参数资料
型号: AOD458
厂商: Alpha & Omega Semiconductor Inc
文件页数: 2/6页
文件大小: 0K
描述: MOSFET N CH 250V 14A TO252
标准包装: 1
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 250V
电流 - 连续漏极(Id) @ 25° C: 14A
开态Rds(最大)@ Id, Vgs @ 25° C: 280 毫欧 @ 7A,10V
Id 时的 Vgs(th)(最大): 4.5V @ 250µA
闸电荷(Qg) @ Vgs: 15nC @ 10V
输入电容 (Ciss) @ Vds: 770pF @ 25V
功率 - 最大: 150W
安装类型: 表面贴装
封装/外壳: TO-252-3,DPak(2 引线+接片),SC-63
供应商设备封装: TO-252
包装: 标准包装
其它名称: 785-1353-6
AOD458
Electrical Characteristics (T J =25°C unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
STATIC PARAMETERS
V/ C
BV DSS
BV DSS
/ ? TJ
I DSS
I GSS
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Zero Gate Voltage Drain Current
Gate-Body leakage current
I D =250μA, V GS =0V, T J =25°C
I D =250μA, V GS =0V, T J =150°C
ID=250μA, VGS=0V
V DS =250V, V GS =0V
V DS =200V, T J =125°C
V DS =0V, V GS =±30V
250
300
0.27
1
10
±100
V
o
μ A
n Α
V GS(th)
R DS(ON)
g FS
V SD
Gate Threshold Voltage
Static Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
V DS =5V, I D =250 μ A
V GS =10V, I D =7A
V DS =40V, I D =7A
I S =1A,V GS =0V
3
3.8
0.22
10
0.74
4.5
0.28
1
V
?
S
V
I S
I SM
Maximum Body-Diode Continuous Current
Maximum Body-Diode Pulsed Current
14
32
A
A
DYNAMIC PARAMETERS
C iss
Input Capacitance
505
637
770
pF
C oss
C rss
R g
Output Capacitance
Reverse Transfer Capacitance
Gate resistance
V GS =0V, V DS =25V, f=1MHz
V GS =0V, V DS =0V, f=1MHz
70
3
1.3
104
7.1
2.6
140
12
3.9
pF
pF
?
SWITCHING PARAMETERS
Q g
Q gs
Q gd
t D(on)
t r
t D(off)
t f
Total Gate Charge
Gate Source Charge
Gate Drain Charge
Turn-On DelayTime
Turn-On Rise Time
Turn-Off DelayTime
Turn-Off Fall Time
V GS =10V, V DS =200V, I D =14A
V GS =10V, V DS =125V, I D =14A,
R G =25 ?
9
12
3.8
4.6
21
58
29
33
15
nC
nC
nC
ns
ns
ns
ns
t rr
Body Diode Reverse Recovery Time
I F =14A,dI/dt=100A/ μ s,V DS =100V
120
150
180
ns
Q rr
Body Diode Reverse Recovery Charge I F =14A,dI/dt=100A/ μ s,V DS =100V
1
1.24
1.5
μ C
A. The value of R θ JA is measured with the device in a still air environment with T A =25°C.
B. The power dissipation P D is based on T J(MAX) =175°C in a TO252 package, using junction-to-case thermal resistance, and is more useful in setting
the upper dissipation limit for cases where additional heatsinking is used.
C. Repetitive rating, pulse width limited by junction temperature T J(MAX) =175°C.
D. The R θ JA is the sum of the thermal impedance from junction to case R θ JC and case to ambient.
E. The static characteristics in Figures 1 to 6 are obtained using <300 μ s pulses, duty cycle 0.5% max.
F. These curves are based on the junction-to-case thermal imped ance which is measured with the device mounted to a large heatsink, assuming a
maximum junction temperature of T J(MAX) =175°C.
G.These tests are performed with the device mounted on 1 in 2 FR-4 board with 2oz. Copper, in a still air environment with T A =25°C.
H. L=60mH, I AS =3.4A, V DD =150V, R G =10 ? , Starting T J =25°C
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE.
Rev0: April 2011
www.aosmd.com
Page 2 of 6
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