参数资料
型号: AS7C25512FT32A-85BIN
厂商: ALLIANCE SEMICONDUCTOR CORP
元件分类: SRAM
英文描述: 512K X 32 STANDARD SRAM, 8.5 ns, PBGA165
封装: LEAD FREE, BGA-165
文件页数: 20/24页
文件大小: 574K
代理商: AS7C25512FT32A-85BIN
4/12/04, v. 1.0
Alliance Semiconductor
5 of 24
AS7C25512FT32A
AS7C25512FT36A
Signal descriptions
Pin
I/O Properties Description
CLK
I
CLOCK
Clock. All inputs except OE, ZZ, and LBO are synchronous to this clock.
A,A0,A1
I
SYNC
Address. Sampled when all chip enables are active and when ADSC or ADSP are asserted.
DQ[a,b,c,d]
I/O
SYNC
Data. Driven as output when the chip is enabled and when OE is active.
CE0
ISYNC
Master chip enable. Sampled on clock edges when ADSP or ADSC is active. When CE0 is
inactive, ADSP is blocked. Refer to the “Synchronous truth table” for more information.
CE1, CE2
ISYNC
Synchronous chip enables, active HIGH, and active LOW, respectively. Sampled on clock
edges when ADSC is active or when CE0 and ADSP are active.
ADSP
I
SYNC
Address strobe processor. Asserted LOW to load a new address or to enter standby mode.
ADSC
I
SYNC
Address strobe controller. Asserted LOW to load a new address or to enter standby mode.
ADV
I
SYNC
Advance. Asserted LOW to continue burst read/write.
GWE
ISYNC
Global write enable. Asserted LOW to write all 32/36 bits. When HIGH, BWE and BW[a:d]
control write enable.
BWE
I
SYNC
Byte write enable. Asserted LOW with GWE HIGH to enable effect of BW[a:d] inputs.
BW[a,b,c,d]
ISYNC
Write enables. Used to control write of individual bytes when GWE is HIGH and BWE is
LOW. If any of BW[a:d] is active with GWE HIGH and BWE LOW, the cycle is a write
cycle. If all BW[a:d] are inactive, the cycle is a read cycle.
OE
I
ASYNC
Asynchronous output enable. I/O pins are driven when OE is active and chip is in read
mode.
LBO
ISTATIC
Selects Burst mode. When tied to VDD or left floating, device follows interleaved Burst order. When
driven LOW, device follows linear Burst order. This signal is internally pulled High.
TDO
O
SYNC
Serial data-out to the JTAG circuit. Delivers data on the negative edge of TCK (BGA only).
TDI
I
SYNC
Serial data-in to the JTAG circuit. Sampled on the rising edge of TCK (BGA only).
TMS
I
SYNC
This pin controls the Test Access Port state machine. Sampled on the rising edge of TCK
(BGA only).
TCK
I
Test Clock
Test Clock. All inputs are sampled on the rising edge of TCK. All outputs are driven from
the falling edge of TCK.
ZZ
I
ASYNC
Snooze. Places device in low power mode; data is retained. Connect to GND if unused.
NC
-
no connects
相关PDF资料
PDF描述
AS7C25512NTD32A-166TQI 512K X 32 ZBT SRAM, 3.5 ns, PQFP100
AS7C3256K18Z-3.5TQC 256K X 18 STANDARD SRAM, 3.5 ns, PQFP100
AS7C33512NTD18A-166BC 512K X 18 ZBT SRAM, 9 ns, PBGA119
AS7C3364FT36B-65TQCN 64K X 36 STANDARD SRAM, 6.5 ns, PQFP100
AS7C3364FT36B-80TQC 64K X 36 STANDARD SRAM, 8 ns, PQFP100
相关代理商/技术参数
参数描述
AS7C25512FT32A-85TQC 制造商:ALSC 制造商全称:Alliance Semiconductor Corporation 功能描述:2.5V 512K x 32/36 flowthrough burst synchronous SRAM
AS7C25512FT32A-85TQCN 制造商:ALSC 制造商全称:Alliance Semiconductor Corporation 功能描述:2.5V 512K x 32/36 flowthrough burst synchronous SRAM
AS7C25512FT32A-85TQI 制造商:ALSC 制造商全称:Alliance Semiconductor Corporation 功能描述:2.5V 512K x 32/36 flowthrough burst synchronous SRAM
AS7C25512FT32A-85TQIN 制造商:ALSC 制造商全称:Alliance Semiconductor Corporation 功能描述:2.5V 512K x 32/36 flowthrough burst synchronous SRAM
AS7C25512FT36A-10TQC 制造商:ALSC 制造商全称:Alliance Semiconductor Corporation 功能描述:2.5V 512K x 32/36 flowthrough burst synchronous SRAM