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参数资料
型号： B80547RE083256
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775
封装： FLIP CHIP, LGA-775
文件页数： 23/94页
文件大小： 2796K
代理商： B80547RE083256
Datasheet
3
Contents
1
Introduction....................................................................................................................... 11
1.1
Terminology......................................................................................................... 12
1.1.1
Processor Packaging Terminology......................................................... 12
1.2
References .......................................................................................................... 13
2
Electrical Specifications.................................................................................................... 15
2.1
FSB and GTLREF ............................................................................................... 15
2.2
Power and Ground Lands ................................................................................... 15
2.3
Decoupling Guidelines ........................................................................................ 15
2.3.1
VCC Decoupling..................................................................................... 16
2.3.2
FSB GTL+ Decoupling ........................................................................... 16
2.3.3
FSB Clock (BCLK[1:0]) and Processor Clocking.................................... 16
2.4
Voltage Identification ........................................................................................... 17
2.4.1
Phase Lock Loop (PLL) Power and Filter............................................... 19
2.5
Reserved, Unused, and TESTHI Signals ............................................................ 20
2.6
FSB Signal Groups.............................................................................................. 20
2.7
GTL+ Asynchronous Signals............................................................................... 22
2.8
Test Access Port (TAP) Connection.................................................................... 23
2.9
FSB Frequency Select Signals (BSEL[2:0]) ........................................................ 23
2.10
Absolute Maximum and Minimum Ratings .......................................................... 23
2.11
Processor DC Specifications............................................................................... 24
2.11.1 Processor DC Specifications.................................................................. 24
2.12
VCC Overshoot Specification.............................................................................. 30
2.12.1 Die Voltage Validation ............................................................................ 30
2.13
GTL+ FSB Specifications .................................................................................... 31
3
Package Mechanical Specifications ................................................................................. 33
3.1
Package Mechanical Drawing ............................................................................. 33
3.2
Processor Component Keep-Out Zones ............................................................. 37
3.3
Package Loading Specifications ......................................................................... 37
3.4
Package Handling Guidelines ............................................................................. 37
3.5
Package Insertion Specifications ........................................................................ 38
3.6
Processor Mass Specification ............................................................................. 38
3.7
Processor Materials............................................................................................. 38
3.8
Processor Markings............................................................................................. 38
3.9
Processor Land Coordinates............................................................................... 40
4
Land Listing and Signal Descriptions ............................................................................... 41
4.1
Processor Land Assignments.............................................................................. 41
4.2
Alphabetical Signals Reference .......................................................................... 62
5
Thermal Specifications and Design Considerations......................................................... 71
5.1
Processor Thermal Specifications....................................................................... 71
5.1.1
Thermal Specifications ........................................................................... 71
5.1.2
Thermal Metrology ................................................................................. 74
5.2
Processor Thermal Features............................................................................... 74
5.2.1
Thermal Monitor ..................................................................................... 74
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