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参数资料
| 型号： | B80547RE083256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 3060 MHz, MICROPROCESSOR, PBGA775 |
| 封装： | FLIP CHIP, LGA-775 |
| 文件页数： | 4/94页 |
| 文件大小： | 2796K |
| 代理商： | B80547RE083256 |
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12
Datasheet
Introduction
1.1
Terminology
A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in the active
state when driven to a low level. For example, when RESET# is low, a reset has been requested.
Conversely, when NMI is high, a nonmaskable interrupt has occurred. In the case of signals where
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“FSB” refers to the interface between the processor and system core logic (a.k.a. the chipset
components). The FSB is a multiprocessing interface to processors, memory, and I/O.
1.1.1
Processor Packaging Terminology
Commonly used terms are explained here for clarification:
Intel Celeron D processor in the 775-land package — Processor in the FC-LGA4
package with a 256 KB L2 cache.
Processor — For this document, the term “processor” is the generic form of the Celeron D
processor in the 775-land package.
Keep-out zone — The area on or near the processor that system design can not use.
Intel 915G\915GV\910GL and 915P/915PL Express chipset — Chipsets that support
DDR and DDR2 memory technology for the Celeron D processor in the 775-land package.
Processor core — Processor core die with integrated L2 cache.
FC-LGA4 package — The Celeron D processor in the 775-land package is available in a
Flip-Chip Land Grid Array 4 package, consisting of a processor core mounted on a substrate
with an integrated heat spreader (IHS).
LGA775 socket — The Celeron D processor in the 775-land package mates with the system
board through a surface mount, 775-land, LGA socket.
Integrated heat spreader (IHS) —A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
Retention mechanism (RM)—Since the LGA775 socket does not include any mechanical
features for heatsink attach, a retention mechanism is required. Component thermal solutions
should attach to the processor via a retention mechanism that is independent of the socket.
Storage conditions—Refers to a non-operational state. The processor may be installed in a
platform, in a tray, or loose. Processors may be sealed in packaging or exposed to free air.
Under these conditions, processor lands should not be connected to any supply voltages, have
any I/Os biased, or receive any clocks. Upon exposure to “free air” (i.e., unsealed packaging or
a device removed from packaging material) the processor must be handled in accordance with
moisture sensitivity labeling (MSL) as indicated on the packaging material.
Functional operation—Refers to normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal, are
satisfied.
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