72
Datasheet
Thermal Specifications and Design Considerations
Refer to the Intel Pentium 4 Processor on 90 nm Process in the 775-Land LGA Package
Thermal Design Guide and the Processor Power Characterization Methodology for the details of
this methodology.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained periods of time. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in
Table 5-1 instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
unlikely event that an application exceeds the TDP recommendation for a sustained period of time.
For more details on the usage of this feature, refer to
Section 5.2. To ensure maximum flexibility
for future requirements, systems should be designed to the Platform Compatibility Guide ‘04 A
guidelines, even if a processor with a lower thermal dissipation is currently planned. In all cases,
the Thermal Monitor feature must be enabled for the processor to remain within
specification.
Table 5-1. Processor Thermal Specifications
Processor
Number
Processor Core
Frequency (GHz)
Thermal Design
Power (W)
Minimum TC
(°C)
Maximum TC (°C)
Notes
325J/326
2.53
84
5
1, 2
NOTES:
1.
Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maxi-
mum power that the processor can dissipate.
2.
This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. There-
fore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and
associated table for the allowed combinations of power and TC.
330J/331
2.66
84
5
335J/336
2.80
84
5
340J/341
2.93
84
5
345J/346
3.06
84
5
351
3.20
84
5
355
3.33
84
5