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参数资料
| 型号： | CS5165GDWR16 |
| 厂商： | ON SEMICONDUCTOR |
| 元件分类： | 稳压器 |
| 英文描述： | 1.5 A SWITCHING CONTROLLER, 1000 kHz SWITCHING FREQ-MAX, PDSO16 |
| 封装： | SOIC-16 |
| 文件页数： | 11/21页 |
| 文件大小： | 718K |
| 代理商： | CS5165GDWR16 |
CS5165
http://onsemi.com
19
Response Time +
1.2 mH
14.2 A
(5.0 V * 2.8 V) +
7.7 ms
Response Time to Load Decrease
(limited by Inductor value)
Response Time +
L
Change in IOUT
VOUT
Example: VOUT = +2.8 V, 14.2 A change in Load Current,
L = 1.2 μH
Response Time +
1.2 mH
14.2 A
2.8 V
+ 6.1 ms
Input and Output Capacitors
These components must be selected and placed carefully
to yield optimal results. Capacitors should be chosen to
provide acceptable ripple on the input supply lines and
regulator output voltage. Key specifications for input
capacitors are their ripple rating, while ESR is important for
output capacitors. For best transient response, a combination
of low value/high frequency and bulk capacitors placed
close to the load will be required.
THERMAL MANAGEMENT
Thermal Considerations for Power
MOSFETs and Diodes
In order to maintain good reliability, the junction
temperature of the semiconductor components should be
kept to a maximum of 150°C or lower. The thermal
impedance (junction to ambient) required to meet this
requirement can be calculated as follows:
Thermal Impedance +
TJUNCTION(MAX) * TAMBIENT
Power
A heatsink may be added to TO220 components to
reduce their thermal impedance. A number of PC board
layout techniques such as thermal vias and additional copper
foil area can be used to improve the power handling
capability of surface mount components.
EMI Management
As a consequence of large currents being turned on and off
at high frequency, switching regulators generate noise as a
consequence of their normal operation. When designing for
compliance with EMI/EMC regulations, additional
components may be added to reduce noise emissions. These
components are not required for regulator operation and
experimental results may allow them to be eliminated. The
input filter inductor may not be required because bulk filter
and bypass capacitors, as well as other loads located on the
board will tend to reduce regulator di/dt effects on the circuit
board and input power supply. Placement of the power
component to minimize routing distance will also help to
reduce emissions.
Layout Guidelines
When laying out the CPU buck regulator on a printed
circuit board, the following checklist should be used to
ensure proper operation of the CS5165.
1. Rapid changes in voltage across parasitic capacitors
and abrupt changes in current in parasitic inductors
are major concerns for a good layout.
2. Keep high currents out of logic grounds.
3. Avoid ground loops as they pick up noise. Use star or
single point grounding. The source of the lower
(synchronous FET) is an ideal point where the input
and output GND planes can be connected.
4. For doublesided PCBs a single large ground plane is
not recommended, since there is little control of
where currents flow and the large surface area can act
as an antenna.
5. Even though double sided PCBs are usually sufficient
for a good layout, fourlayer PCBs are the optimum
approach to reducing susceptibility to noise. Use the
two internal layers as the +5.0 V and GND planes, and
the top and bottom layers for the vias.
6. Keep the inductor switching node small by placing
the output inductor, switching and synchronous FETs
close together.
7. The FET gate traces to the IC must be as short,
straight, and wide as possible. Ideally, the IC has to be
placed right next to the FETs.
8. Use fewer, but larger output capacitors, keep the
capacitors clustered, and use multiple layer traces
with heavy copper to keep the parasitic resistance
low.
9. Place the switching FET as close to the +5.0 V input
capacitors as possible.
10. Place the output capacitors as close to the load as
possible.
11. Place the VFB filter resistor in series with theVFB pin
(pin 16) right at the pin.
12. Place the VFB filter capacitor right at the VFB pin (pin
16).
13. The “Droop” Resistor (embedded PCB trace) has to
be wide enough to carry the full load current.
14. Place the VCC bypass capacitor as close as possible to
the VCC pin.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| CS-5165HDW16 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Voltage-Mode SMPS Controller |
| CS-5165HDWR16 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Voltage-Mode SMPS Controller |
| CS5165HGDW16 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| CS5165HGDWR16 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| CS5166 | 功能描述:SCREWDRIVER,5/16"X6",SLOTTED 制造商:apex tool group 系列:* 零件状态:在售 标准包装:1 |
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