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参数资料
型号： DS3112+
厂商： Maxim Integrated Products
文件页数： 101/133页
文件大小： 0K
描述： IC MUX TEMPE T3/E3 256-BGA
产品培训模块： Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装： 40
控制器类型： 调帧器，多路复用器
接口： 并行/串行
电源电压： 3.135 V ~ 3.465 V
电流 - 电源： 150mA
工作温度： 0°C ~ 70°C
安装类型： 表面贴装
封装/外壳： 256-LBGA
供应商设备封装： 256-PBGA（27x27）
包装： 管件
产品目录页面： 1419 (CN2011-ZH PDF)
DS3112
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DETAILED DESCRIPTION
The DS3112 TEMPE (T3 E3 MultiPlexEr) device can be used either as a multiplexer or a T3/E3 framer.
When the device is used as a multiplexer, it can be operated in one of three modes:
M13—Multiplex 28 T1 lines into a T3 data stream
E13—Multiplex 16 E1 lines into an E3 data stream
G.747—Multiplex 21 E1 lines into a T3 data stream
See Figure 1-1, Figure 1-2, and Figure 1-3 for block diagrams of these three modes. In each of the block
diagrams, the receive section is at the bottom and the transmit section is at the top. The receive path is
defined as incoming T3/E3 data and the transmit path is defined as outgoing T3/E3 data. When the device
is operated solely as a T3 or E3 framer, the multiplexer portion of the device is disabled and the raw
T3/E3 payload will be output at the FRD output and input at the FTD input. See Figure 1-1 and
Figure 1-2 for details.
In the receive path, raw T3/E3 data is clocked into the device (either in a bipolar or unipolar fashion) with
the HRCLK at the HRPOS and HRNEG inputs. The data is then framed by the T3/E3 framer and passed
through the two-step demultiplexing process to yield the resultant T1 and E1 data streams, which are
output at the LRCLK and LRDAT outputs. In the transmit path, the reverse occurs. The T1 and E1 data
streams are input to the device at the LTCLK and LTDAT inputs. The device will sample these inputs
and then multiplex the T1 and E1 data streams through a two-step multiplexing process to yield the
resultant T3 or E3 data stream. Then this data stream is passed through the T3/E3 formatter to have the
framing overhead added, and the final data stream to be transmitted is output at the HTPOS and HTNEG
outputs using the HTCLK output.
The DS3112 has been designed to meet all of the latest telecommunications standards. Section 1.1 lists all
of the applicable standards for the device.
The TEMPE device has a number of advanced features such as:
The ability to drop and insert up to two T1 or E1 ports
An on-board HDLC controller with 256-byte buffers
An on-board Bit Error Rate Tester (BERT)
Advanced diagnostics to create and detect many different types of errors
See Section 1.2 for a complete list of main features within the device.
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相关代理商/技术参数
参数描述
DS3112+ 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS3112+W 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS3112D1 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS3112D1+ 功能描述:网络控制器与处理器 IC TEMPE T3/E3 MUX FRMR & M13/E13/G.747 MUX RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray
DS3112DK 功能描述:网络开发工具 DS3112 Dev Kit RoHS:否 制造商:Rabbit Semiconductor 产品:Development Kits 类型:Ethernet to Wi-Fi Bridges 工具用于评估:RCM6600W 数据速率:20 Mbps, 40 Mbps 接口类型:802.11 b/g, Ethernet 工作电源电压:3.3 V
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