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参数资料
| 型号： | DSP56F826BU80E |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 13/56页 |
| 文件大小： | 0K |
| 描述： | IC DSP 80MHZ 64KB FLASH 100LQFP |
| 标准包装： | 90 |
| 系列： | 56F8xx |
| 核心处理器： | 56800 |
| 芯体尺寸： | 16-位 |
| 速度： | 80MHz |
| 连通性： | EBI/EMI，SCI，SPI，SSI |
| 外围设备： | POR，WDT |
| 输入/输出数： | 46 |
| 程序存储器容量： | 67KB（33.5K x 16） |
| 程序存储器类型： | 闪存 |
| RAM 容量： | 4.5K x 16 |
| 电压 - 电源 (Vcc/Vdd)： | 2.25 V ~ 2.75 V |
| 振荡器型： | 外部 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 100-LQFP |
| 包装： | 托盘 |
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56F826 Technical Data, Rev. 14
20
Freescale Semiconductor
Notes:
1. Theta-JA determined on 2s2p test boards is frequently lower than would be observed in an application.
Determined on 2s2p thermal test board.
2. Junction to ambient thermal resistance, Theta-JA (RθJA) was simulated to be equivalent to the JEDEC
specification JESD51-2 in a horizontal configuration in natural convection. Theta-JA was also simulated on
a thermal test board with two internal planes (2s2p, where “s” is the number of signal layers and “p” is the
number of planes) per JESD51-6 and JESD51-7. The correct name for Theta-JA for forced convection or with
the non-single layer boards is Theta-JMA.
3. Junction to case thermal resistance, Theta-JC (RθJC), was simulated to be equivalent to the measured values
using the cold plate technique with the cold plate temperature used as the “case” temperature. The basic cold
plate measurement technique is described by MIL-STD 883D, Method 1012.1. This is the correct thermal
metric to use to calculate thermal performance when the package is being used with a heat sink.
4. Thermal Characterization Parameter, Psi-JT (
ΨJT), is the “resistance” from junction to reference point
thermocouple on top center of case as defined in JESD51-2.
ΨJT is a useful value to use to estimate junction
temperature in steady state customer environments.
5. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
6. See Section 5.1 for more details on thermal design considerations.
7. TJ = Junction Temperature
TA = Ambient Temperature
Table 3-3 Thermal Characteristics6
Characteristic
Comments
Symbol
Value
Unit
Notes
100-pin LQFP
Junction to ambient
Natural convection
RθJA
48.3
°C/W
2
Junction to ambient (@1m/sec)
RθJMA
43.9
°C/W
2
Junction to ambient
Natural convection
Four layer board (2s2p)
RθJMA
(2s2p)
40.7
°C/W
1.2
Junction to ambient (@1m/sec)
Four layer board (2s2p)
RθJMA
38.6
°C/W
1,2
Junction to case
RθJC
13.5
°C/W
3
Junction to center of case
ΨJT
1.0
°C/W
4, 5
I/O pin power dissipation
P I/O
User Determined
W
Power dissipation
P D
P D = (IDD x VDD + P I/O)W
Junction to center of case
PDMAX
(TJ - TA) /R
θJA
W7
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