参数资料
型号: DSP56F826BU80E
厂商: Freescale Semiconductor
文件页数: 2/56页
文件大小: 0K
描述: IC DSP 80MHZ 64KB FLASH 100LQFP
标准包装: 90
系列: 56F8xx
核心处理器: 56800
芯体尺寸: 16-位
速度: 80MHz
连通性: EBI/EMI,SCI,SPI,SSI
外围设备: POR,WDT
输入/输出数: 46
程序存储器容量: 67KB(33.5K x 16)
程序存储器类型: 闪存
RAM 容量: 4.5K x 16
电压 - 电源 (Vcc/Vdd): 2.25 V ~ 2.75 V
振荡器型: 外部
工作温度: -40°C ~ 85°C
封装/外壳: 100-LQFP
包装: 托盘
56F826 Technical Data, Rev. 14
10
Freescale Semiconductor
2.2 Signals and Package Information
All inputs have a weak internal pull-up circuit associated with them. These pull-up circuits are always
enabled. Exceptions:
1. When a pin is owned by GPIO, then the pull-up may be disabled under software control.
2. TCK has a weak pull-down circuit always active.
Table 2-1 56F826 Signal and Package Information for the 100 Pin LQFP
Signal
Name
Pin No.
Type
Description
VDD
20
VDD
Power—These pins provide power to the internal structures of the chip, and are
generally connected to a 2.5V supply.
VDD
64
VDD
94
VDD
VDDA
59
VDDA
Analog Power—This pin is a dedicated power pin for the analog portion of the
chip and should be connected to a low-noise 3.3V supply.
VDDIO
5VDDIO
Power In/Out—These pins provide power to the I/O structures of the chip, and
are generally connected to a 3.3V supply.
VDDIO
30
VDDIO
57
VDDIO
80
VDDIO
VSS
19
VSS
GND—These pins provide grounding for the internal structures of the chip. All
should be attached to VSS.
VSS
63
VSS
95
VSS
VSSA
60
VSSA
Analog Ground—This pin supplies an analog ground.
VSSIO
6VSSIO
GND In/Out—These pins provide grounding for the I/O ring on the chip. All
should be attached to VSS.
VSSIO
31
VSSIO
58
VSSIO
81
VSSIO
TCS
99
Input/Output
(Schmitt)
TCS—This pin is reserved for factory use. It must be tied to VSS for normal use.
In block diagrams, this pin is considered an additional VSS.
EXTAL
61
Input
External Crystal Oscillator Input—This input should be connected to a 4MHz
external crystal or ceramic resonator. For more information, please refer to
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