参数资料
型号: EP2AGX65DF29I3N
厂商: Altera
文件页数: 10/90页
文件大小: 0K
描述: IC ARRIA II GX FPGA 65K 780FBGA
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 4
系列: Arria II GX
LAB/CLB数: 2530
逻辑元件/单元数: 60214
RAM 位总计: 5371904
输入/输出数: 364
电源电压: 0.87 V ~ 0.93 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 780-BBGA
供应商设备封装: 780-FBGA(29x29)
其它名称: 544-2702
1–10
Chapter 1: Device Datasheet for Arria II Devices
Electrical Characteristics
December 2013
Altera Corporation
Table 1–12 lists the OCT termination calibration accuracy specifications for
Arria II GZ devices.
50-
R
S
3.0, 2.5, 1.8, 1.5,
1.2
50-
series OCT
with calibration
VCCIO = 3.0, 2.5,
1.8, 1.5, 1.2
± 10
%
100-
R
D
2.5
100-
differential
OCT without
calibration
VCCIO = 2.5
± 30
%
Note to Table 1–11:
(1) OCT with calibration accuracy is valid at the time of calibration only.
Table 1–11. OCT With and Without Calibration Specification for Arria II GX Device I/Os (Note 1) (Part 2 of 2)
Symbol
Description
Conditions (V)
Calibration Accuracy
Unit
Commercial
Industrial
Table 1–12. OCT with Calibration Accuracy Specifications for Arria II GZ Devices
Symbol
Description
Conditions (V)
Calibration Accuracy
Unit
C2
C3,I3
C4,I4
25-
R
S
3.0, 2.5, 1.8, 1.5,
1.2 (2)
25-
series OCT
with calibration
VCCIO = 3.0, 2.5,
1.8, 1.5, 1.2
± 8
%
50-
R
S
3.0, 2.5, 1.8, 1.5,
1.2
50-
internal series
OCT with calibration
VCCIO = 3.0, 2.5,
1.8, 1.5, 1.2
± 8
%
50-
R
T
2.5, 1.8, 1.5, 1.2
50-
internal parallel
OCT with calibration
VCCIO = 2.5, 1.8,
1.5, 1.2
± 10
%
20-
, 40- , and
60-
R
S
3.0, 2.5, 1.8, 1.5,
1.2 (3)
20-
, 40-and
60-
R
S expanded
range for internal
series OCT with
calibration
VCCIO = 3.0, 2.5,
1.8, 1.5, 1.2
± 10
%
25-
R
S_left_shift
3.0, 2.5, 1.8, 1.5,
1.2
25-
R
S_left_shift
internal left shift
series OCT with
calibration
VCCIO = 3.0, 2.5,
1.8, 1.5, 1.2
± 10
%
Notes to Table 1–12:
(1) OCT calibration accuracy is valid at the time of calibration only.
(2) 25-
R
S is not supported for 1.5 V and 1.2 V in Row I/O.
(3) 20-
R
S is not supported for 1.5 V and 1.2 V in Row I/O.
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EP2AGX65DF29I5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX65DF29I5N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 2530 LABs 364 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C4 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C4N 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256
EP2AGX95DF25C5 功能描述:FPGA - 现场可编程门阵列 FPGA - Arria II GX 3747 LABs 260 IOs RoHS:否 制造商:Altera Corporation 系列:Cyclone V E 栅极数量: 逻辑块数量:943 内嵌式块RAM - EBR:1956 kbit 输入/输出端数量:128 最大工作频率:800 MHz 工作电源电压:1.1 V 最大工作温度:+ 70 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-256