参数资料
型号: EPF6024ATC144-3N
厂商: Altera
文件页数: 18/52页
文件大小: 0K
描述: IC FLEX 6000 FPGA 24K 144-TQFP
产品培训模块: Three Reasons to Use FPGA's in Industrial Designs
标准包装: 180
系列: FLEX 6000
LAB/CLB数: 196
逻辑元件/单元数: 1960
输入/输出数: 117
门数: 24000
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
Altera Corporation
25
FLEX 6000 Programmable Logic Device Family Data Sheet
Figure 14. IOE Connection to Column Interconnect
SameFrame
Pin-Outs
3.3-V FLEX 6000 devices support the SameFrame pin-out feature for
FineLine BGA packages. The SameFrame pin-out feature is the
arrangement of balls on FineLine BGA packages such that the lower-ball-
count packages form a subset of the higher-ball-count packages.
SameFrame pin-outs provide the flexibility to migrate not only from
device to device within the same package, but also from one package to
another. A given printed circuit board (PCB) layout can support multiple
device density/package combinations. For example, a single board layout
can support an EPF6016A device in a 100-pin FineLine BGA package or an
EPF6024A device in a 256-pin FineLine BGA package.
The Altera software packages provide support to design PCBs with
SameFrame pin-out devices. Devices can be defined for present and future
use. The Altera software packages generate pin-outs describing how to lay
out a board to take advantage of this migration (see Figure 15).
Row Interconnect
Column Interconnect
Each IOE can drive two
column interconnect channels.
Each IOE data and OE signal is
driven to a local interconnect.
Any LE can drive a
pin through the row
and local interconnect.
IOE
LAB
FastFLEX I/O: An
LE can drive a
pin through a local
interconnect for faster
clock-to-output times.
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