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参数资料
| 型号： | FAN5355UC08X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 24/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 12WLCSP |
| 标准包装： | 3,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.75 V ~ 1.4375 V |
| 输入电压： | 2.7 V ~ 5.5 V |
| 频率 - 开关： | 3MHz |
| 电流 - 输出： | 1.1A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-UFBGA，WLCSP |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 12-WLCSP |
Physical Dimensions
BALL A1
INDEX AREA
E
A
B
(?0.25)
0.50
2X
0.03 C
D
Cu PAD
A1
0.50
1.00
(?0.35)
SOLDER MASK
OPENING
TOP VIEW
2X
0.03 C
RECOMMENDED LAND PATTERN (NSMD)
0.06 C
0.05 C
D
C
0.625
0.539
SEATING PLANE
0.332±0.018
0.250±0.025
SIDE VIEWS
(X)+/-.018
0.50
0.50
(Y)+/-.018
1 2
3
D
C
B
A
0.005 C A B
12 X ?0.315 +/- .025
A. NO JEDEC REGISTRATION APPLIES
B. DIMENSIONS ARE IN MILLIMETERS.
C. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
D DATUM C, THE SEATING PLANE, IS DEFINED
BY THE SPHERICAL CROWNS OF THE BALLS.
F FOR DIMENSIONS D, E, X, AND Y SEE
PRODUCT DATASHEET.
BOTTOM VIEW
F. BALL COMPOSITION: Sn95.5Ag3.9Cu0.6
SAC405 ALLOY
G. DRAWING FILENAME: MKT-UC012AArev2
Figure 47. 12-Bump, Wafer-Level Chip-Scale Package (WLCSP), 0.5mm Pitch
Product-Specific Dimensions
Product
FAN5355UC
D
2.200 ±0.030
E
1.430 ±0.030
X
0.220
Y
0.355
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without
notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most
recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty
therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/ .
? 2008 Fairchild Semiconductor Corporation
FAN5355 ? Rev. 1.1.0
24
www.fairchildsemi.com
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