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参数资料
| 型号： | FAN5355UC08X |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 4/26页 |
| 文件大小： | 0K |
| 描述： | IC REG BUCK SYNC ADJ 12WLCSP |
| 标准包装： | 3,000 |
| 类型： | 降压（降压） |
| 输出类型： | 可调式 |
| 输出数： | 1 |
| 输出电压： | 0.75 V ~ 1.4375 V |
| 输入电压： | 2.7 V ~ 5.5 V |
| 频率 - 开关： | 3MHz |
| 电流 - 输出： | 1.1A |
| 同步整流器： | 是 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 12-UFBGA，WLCSP |
| 包装： | 带卷 (TR) |
| 供应商设备封装： | 12-WLCSP |
Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above
the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended
exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings
are stress ratings only.
Symbol Parameter
Min.
Max.
Unit
V CC
ESD
T J
T STG
AVIN, SW, PVIN Pins
Other Pins
Electrostatic Discharge
Protection Level
Junction Temperature
Storage Temperature
Human Body Model per JESD22-A114
Charged Device Model per JESD22-C101
-0.3
-0.3
–40
–65
6.5
AVIN + 0.3 (6)
3.5
1.5
+150
+150
V
V
KV
KV
°C
°C
T L
Lead Soldering Temperature, 10 Seconds
+260
°C
Note:
6. Lesser of 6.5V or AVIN+0.3V.
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating
conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding
them or designing to absolute maximum ratings.
Symbol Parameter
Min.
Max.
Unit
SDA and SCL Voltage Swing
V IN
f
V CCIO
T A
T J
Supply Voltage
Frequency Range
Ambient Temperature
Junction Temperature
(7)
2.7
2.7
–40
–40
5.5
3.3
2.5
+85
+125
V
MHz
V
°C
°C
7. The I C interface operates with t HD;DAT = 0 as long as the pull-up voltage for SDA and SCL is less than 2.5V. If voltage
increased to 80ns. Most I C masters change SDA near the midpoint between the falling and rising edges of SCL, which
Note:
2
swings greater than 2.5V are required (for example if the I 2 C bus is pulled up to V IN ), the minimum t HD;DAT must be
2
provides ample t HD;DAT .
Dissipation Ratings (8)
Package
Molded Leadless Package (MLP)
Wafer-Level Chip-Scale Package (WLCSP)
θ JA (9)
49oC/W
110oC/W
Power Rating at T A ≤ 25°C
2050mW
900mW
Derating Factor > T A = 25oC
21mW/oC
9mW/oC
Notes:
8.
9.
Maximum power dissipation is a function of T J(max) , θ JA , and T A . The maximum allowable power dissipation at any
allowable ambient temperature is P D = [T J(max) - T A ] / θ JA .
This thermal data is measured with high-K board (four-layer board according to JESD51-7 JEDEC standard).
? 2008 Fairchild Semiconductor Corporation
FAN5355 ? Rev. 1.1.0
4
www.fairchildsemi.com
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