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参数资料
| 型号： | FDB8447L |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 40V 15A D2PAK |
| 标准包装： | 1 |
| 系列： | PowerTrench® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 40V |
| 电流 - 连续漏极(Id) @ 25° C： | 15A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 8.5 毫欧 @ 14A，10V |
| Id 时的 Vgs(th)（最大）： | 3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 52nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 2620pF @ 20V |
| 功率 - 最大： | 3.1W |
| 安装类型： | 表面贴装 |
| 封装/外壳： | TO-263-3，D²Pak（2 引线+接片），TO-263AB |
| 供应商设备封装： | D²PAK |
| 包装： | 标准包装 |
| 产品目录页面： | 1606 (CN2011-ZH PDF) |
| 其它名称： | FDB8447LDKR |
Electrical Characteristics T J = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
? BV DS S
? T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = 250 μ A, V GS = 0V
I D = 250 μ A, referenced to 25°C
V DS = 32V, V GS = 0V
V GS = ±20V, V GS = 0V
40
35
1
±100
V
mV/° C
μ A
nA
On Characteristics (Note 2)
V GS(th)
? V GS(th )
? T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = 250 μ A
I D = 250 μ A, referenced to 25°C
1
1.9
-5
3
V
mV/°C
V GS = 10V, I D = 14A
7.4
8.5
r DS(on)
Static Drain to Source On Resistance
V GS = 4.5V, I D = 11A
8.7
11.0
m ?
V GS = 10V, I D = 14A, T J =125°C
10.8
12.4
g FS
Forward Transconductance
V DS = 5V, I D = 14A
58
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 20V, V GS = 0V,
f = 1MHz
f = 1MHz
1970
250
150
1.0
2620
335
225
pF
pF
pF
?
Switching Characteristics
t d(on)
t r
t d(off)
t f
Q g(TOT)
Q g(TOT)
Q gs
Q gd
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge, V GS = 10V
Total Gate Charge, V GS = 5V
Gate to Source Gate Charge
Gate to Drain “Miller” Charge
V DD = 20V, I D = 14A
V GS = 10V, R GEN = 6 ?
V DD =20V, I D = 14A
V GS = 10V
11
6
28
4
37
20
6
7
20
12
45
10
52
28
ns
ns
ns
ns
nC
nC
nC
nC
Drain-Source Diode Characteristics
V SD
Source to Drain Diode Forward Voltage
V GS = 0V, I S = 14A
(Note 2)
0.8
1.2
V
t rr
Q rr
Reverse Recovery Time
Reverse Recovery Charge
I F = 14A, di/dt = 100A/ μ s
28
24
42
36
ns
nC
Notes:
1: R θ JA is the sum of the junction-to-case and case-to- ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the drain pins.
R θ JC is guaranteed by design while R θ JA is determined by the user ’s board design.
a. 40°C/W when mounted on a 1 in 2 pad of 2 oz copper
b. 62.5°C/W when mounted on a minimum pad.
2: Pulse Test: Pulse Width < 30 0 μ s, Duty cycle < 2.0%.
3: Starting T J = 25°C, L = 1mH, I AS = 17.5A, V DD = 40V, V GS = 10V.
FDB8447L Rev.C
2
www.fairchildsemi.com
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