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| 型号： | FDMA7670 |
| 厂商： | Fairchild Semiconductor |
| 文件页数： | 2/6页 |
| 文件大小： | 0K |
| 描述： | MOSFET N-CH 30V 6-MLP 2X2 |
| 标准包装： | 3,000 |
| 系列： | PowerTrench® |
| FET 型： | MOSFET N 通道，金属氧化物 |
| FET 特点： | 逻辑电平门 |
| 漏极至源极电压(Vdss)： | 30V |
| 电流 - 连续漏极(Id) @ 25° C： | 11A |
| 开态Rds（最大）@ Id, Vgs @ 25° C： | 15 毫欧 @ 11A，10V |
| Id 时的 Vgs(th)（最大）： | 3V @ 250µA |
| 闸电荷(Qg) @ Vgs： | 22nC @ 10V |
| 输入电容 (Ciss) @ Vds： | 1360pF @ 15V |
| 功率 - 最大： | 900mW |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-WFDFN 裸露焊盘 |
| 供应商设备封装： | 6-MLP（2x2） |
| 包装： | 带卷 (TR) |
Electrical Characteristics T J = 25 °C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Off Characteristics
BV DSS
Δ BV DSS
Δ T J
I DSS
I GSS
Drain to Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I D = 250 μ A, V GS = 0 V
I D = 250 μ A, referenced to 25 °C
V DS = 24 V, V GS = 0 V
V GS = 20 V, V DS = 0 V
30
15
1
100
V
mV/°C
μ A
nA
On Characteristics
V GS(th)
Δ V GS(th)
Δ T J
Gate to Source Threshold Voltage
Gate to Source Threshold Voltage
Temperature Coefficient
V GS = V DS , I D = 250 μ A
I D = 250 μ A, referenced to 25 °C
1.0
2.0
–6
3.0
V
mV/°C
V GS = 10 V, I D = 11 A
10
15
r DS(on)
Static Drain to Source On Resistance
V GS = 4.5 V, I D = 9 A
14
22
m Ω
V GS = 10 V, I D = 11 A, T J = 125 °C
14
21
g FS
Forward Transconductance
V DS = 5 V, I D = 11 A
36
S
Dynamic Characteristics
C iss
C oss
C rss
R g
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Gate Resistance
V DS = 15 V, V GS = 0 V
f = 1.0 MHz
1020
315
35
1.7
1360
415
55
pF
pF
pF
Ω
Switching Characteristics
t d(on)
Turn-On Delay Time
8
15
ns
t r
t d(off)
t f
Q g
Rise Time
Turn-Off Delay Time
Fall Time
Total Gate Charge
V DD = 15 V, I D = 11 A
V GS = 10 V, R GEN = 6 Ω
V GS = 0 V to 10 V
3
19
3
16
10
34
10
22
ns
ns
ns
nC
Q g
Q gs
Total Gate Charge
Gate to Source Gate Charge
V GS = 0 V to 4.5 V
V DD = 15 V,
I D = 11 A
8
3.0
10
nC
nC
Q gd
Gate to Drain “Miller” Charge
2.2
nC
Drain-Source Diode Characteristics
I S
Maximum Continuous Drain-Source Diode Forward Current
2
A
V SD
t rr
Q rr
Source to Drain Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery Charge
V GS = 0 V, I S = 2 A
I F = 11 A, di/dt = 100 A/ μ s
(Note 2)
0.8
21
6
1.2
33
12
V
ns
nC
NOTES:
1. R θ JA is determined with the device mounted on a 1 in 2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. R θ JC is guaranteed by design while R θ CA is determined by
the user's board design.
a. 52 °C/W when mounted
on a 1 in 2 pad of 2 oz copper.
2. Pulse Test: Pulse Width < 300 μ s, Duty cycle < 2.0%.
b. 145 °C/W when mounted on a
minimum pad of 2 oz copper.
?2012 Fairchild Semiconductor Corporation
FDMA7670 Rev.C 5
2
www.fairchildsemi.com
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