参数资料
型号: FDN359BN
厂商: Fairchild Semiconductor
文件页数: 3/6页
文件大小: 0K
描述: MOSFET N-CH 30V 2.7A 3SSOT
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 30V
电流 - 连续漏极(Id) @ 25° C: 2.7A
开态Rds(最大)@ Id, Vgs @ 25° C: 46 毫欧 @ 2.7A,10V
Id 时的 Vgs(th)(最大): 3V @ 250µA
闸电荷(Qg) @ Vgs: 7nC @ 5V
输入电容 (Ciss) @ Vds: 650pF @ 15V
功率 - 最大: 460mW
安装类型: 表面贴装
封装/外壳: TO-236-3,SC-59,SOT-23-3
供应商设备封装: 3-SSOT
包装: 标准包装
其它名称: FDN359BNFSDKR
Electrical Characteristics
T A = 25°C unless otherwise noted
Symbol
Parameter
Test Conditions
Min
Typ
Max
Units
Drain–Source Diode Characteristics and Maximum Ratings
I S
Maximum Continuous Drain–Sourc e Diode Forward Current
0.42
A
V SD
Drain–Source Diode Forward
V GS = 0 V,
I S = 0.42 A
(Note 2)
0.7
1.2
V
Voltage
trr
Qrr
Diode Reverse Recovery Time
Diode Reverse Recovery Charge
IF = 2.7A, diF/dt = 100 A/μs
12
3
20
5
ns
nC
otes:
1.
R θ JA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of
the drain pins. R θ JC is guaranteed by design while R θ CA is determined by the user's board design.
a) 250 ° C/W when mounted on a
0.02 in 2 pad of 2 oz. copper.
Scale 1 : 1 on letter size paper
b) 270°C/W when mounted on a
minimum pad.
2.
Pulse Test: Pulse Width ≤ 300 μ s, Duty Cycle ≤ 2.0%
FDN359BN Rev A(W)
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