参数资料
型号: FDS2670
厂商: Fairchild Semiconductor
文件页数: 5/6页
文件大小: 0K
描述: MOSFET N-CH 200V 3A SO-8
产品培训模块: High Voltage Switches for Power Processing
产品变化通告: Mold Compound Change 12/Dec/2007
产品目录绘图: Power MOSFET, 8-SOP, SO-8
标准包装: 1
系列: PowerTrench®
FET 型: MOSFET N 通道,金属氧化物
FET 特点: 标准
漏极至源极电压(Vdss): 200V
电流 - 连续漏极(Id) @ 25° C: 3A
开态Rds(最大)@ Id, Vgs @ 25° C: 130 毫欧 @ 3A,10V
Id 时的 Vgs(th)(最大): 4.5V @ 250µA
闸电荷(Qg) @ Vgs: 43nC @ 10V
输入电容 (Ciss) @ Vds: 1228pF @ 100V
功率 - 最大: 1W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: SO-8
包装: 标准包装
产品目录页面: 1604 (CN2011-ZH PDF)
其它名称: FDS2670DKR
Typical Characteristics
15
2000
12
I D = 3.0 A
V DS = 40V
70
f = 1MHz
V GS = 0 V
100 V
1500
C ISS
9
1000
6
500
3
C OSS
0
0
C RSS
0
5
10
15
20
25
30
35
40
0
20
40
60
80
100
Q g , GATE CHARGE (nC)
Figure 7. Gate Charge Characteristics.
100
100
V DS , DRAIN TO SOURCE VOLTAGE (V)
Figure 8. Capacitance Characteristics.
10
R DS(ON) LIMIT
100 μ s
80
SINGLE PULSE
R θ JA = 125°C/W
T A = 25°C
1
0.1
0.01
V GS = 10V
SINGLE PULSE
R θ JA = 125 o C/W
T A = 25 o C
10ms
100ms
1s
10s
DC
60
40
20
0
0.001
0.01
0.1
1
10
100
1000
0.001
t 1 , TIME (sec)
0.1
1
10
100
1000
Figure 9. Maximum Safe Operating Area.
Figure 10. Single Pulse Maximum
Power Dissipation.
1
D = 0.5
0.2
R θ JA (t) = r(t) + R θ JA
R θ JA = 125°C/W
0.1
0.1
P(pk)
0.05
t 1
t 2
0.01
0.02
0.01
SINGLE PULSE
T J - T A = P * R θ JA (t)
Duty Cycle, D = t 1 / t 2
0.001
0.01
0.1
1
10
100
1000
t 1 , TIME (sec)
Figure 11. Transient Thermal Response Curve.
Thermal characterization performed using the conditions described in Note 1c.
Transient thermal response will change depending on the circuit board design.
FDS2670 Rev C1(W)
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