- 您现在的位置：买卖IC网 > Datasheet目录436 > GA1A2S100SS (Sharp Microelectronics)LIGHT DETECTOR OPIC 555NM Datasheet资料下载
参数资料
| 型号： | GA1A2S100SS |
| 厂商： | Sharp Microelectronics |
| 文件页数： | 6/10页 |
| 文件大小： | 0K |
| 描述： | LIGHT DETECTOR OPIC 555NM |
| 标准包装： | 2,000 |
| 带接近传感器： | 无 |
| 波长： | 555nm |
| 电源电压： | 2.7 V ~ 3.6 V |
| 输出类型： | 电流 |
| 工作温度： | -40°C ~ 85°C |
| 安装类型： | 通孔 |
| 封装/外壳： | 径向 - 3 引线，成形 |
| 包装： | 散装 |
| 其它名称： | 425-2778 425-2778-2 425-2778-2-ND GA1A2S100SS-ND |
GA1A2S100SS/GA1A2S100LY
Fig. 2 Block Diagram (Equivalent Circuit)
V CC
Main PD
(PDA, PDC)
C u rrent AMP 2
( W ith temperat u re
compensation f u nction)
PD for spectral
sensiti v ity
compensation
(PDB)
C u rrent AMP 1
OUT
G N D
■ Design Considerations
Design Guidelines
1. This product is not designed to be electromagnetic- and ionized-particle-radiation resistant.
2. Sharp recommends bypass capacitors of at least 0.01 μ F between V CC and ground, as close as
possible to the device.
3. This device contains three photodiodes and amplifies the differential of the photocurrent in each diode. Sharp
recommends that the light which falls on the device illuminate it as uniformly as possible.
4. For the most reliable sensing, Sharp recommends guarding the device from stray incident light.
■ Manufacturing Guidelines
Soldering Instructions
1. Sharp does not recommend soldering this part using methods that include preheat or solder reflow.
2. When mounting, care should be taken to avoid boundary exfoliation (pad lifting) between the solder and the cir-
cuit board.
3. If hand soldering, use temperatures ≤ 260°C for ≤ 5 seconds.
4. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or
defects in plated connections. Internal connections may be severed due to mechanical force placed on the pack-
age due to the PCB flexing during the soldering process.
Cleaning Instructions
1. Confirm this device's resistance to process chemicals before use, as certain process chemicals may affect the
optical characteristics.
2. Solvent cleaning: Solvent temperature should be 45°C or below. Immersion time should be 3 minutes or less.
3. Ultrasonic cleaning: The effect upon devices varies due to cleaning bath size, ultrasonic power output, cleaning
time, PCB size and device mounting circumstances. Sharp recommends testing using actual production condi-
tions to confirm the harmlessness of the ultrasonic cleaning methods.
4. Recommended solvent materials: Ethyl alcohol, Methyl alcohol, and Isopropyl alcohol.
Sheet No.: D1-A00501EN
6
相关PDF资料 |
PDF描述 |
|---|---|
| GF570 | LAMP INCANDESCENT |
| GL100MN0MP1 | EMITTER IR 940NM GP 3.0MW SMD |
| GL100MN1MP1 | IRED 940NM TOP MNT SMD |
| GL100MN3MP1 | EMITTER IR 940NM HP 6.0MW SMD |
| GL390V | EMITTER IR 950NM 9MW T/H |
相关代理商/技术参数 |
参数描述 |
|---|---|
| GA1A-3 | 制造商:SAE Power 功能描述: |
| GA1A3Q | 制造商:NEC 制造商全称:NEC 功能描述:MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE NPN TRANSISTOR |
| GA1A4M | 制造商:NEC 制造商全称:NEC 功能描述:MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE NPN TRANSISTOR |
| GA1A4M-T1 | 制造商:NEC 制造商全称:NEC 功能描述:MEDIUM SPEED SWITCHING RESISTOR BUILT-IN TYPE NPN TRANSISTOR |
| GA1A4M-T1-A | 制造商:Renesas Electronics Corporation 功能描述:Trans Digital BJT NPN 50V 100mA 3-Pin SC-70 T/R |
发布紧急采购，3分钟左右您将得到回复。