参数资料
型号: GWM160-0055P3
厂商: IXYS
文件页数: 6/6页
文件大小: 0K
描述: IC FULL BRIDGE 3PH W/MOSF ISODIL
标准包装: 20
FET 型: 6 N-沟道(3 相桥)
FET 特点: 标准
漏极至源极电压(Vdss): 55V
电流 - 连续漏极(Id) @ 25° C: 160A
开态Rds(最大)@ Id, Vgs @ 25° C: 3 毫欧 @ 100A,10V
Id 时的 Vgs(th)(最大): 4V @ 1mA
闸电荷(Qg) @ Vgs: 90nC @ 10V
安装类型: 表面贴装
封装/外壳: ISOPLUS-DIL?
供应商设备封装: ISOPLUS-DIL?
包装: 管件
GWM 160-0055P3
70
60
50
160 A
100 A
30
25
20
100 A
160 A
I F = 50 A
V R = 24 V
T J = 125°C
15
I F = 50 A
V R = 24 V
T J = 125°C
40
10
400
500
600
700
800
900 1000 1100
400
500
600
700
800
900 1000 1100
-di F /dt [A/μs]
-di F /dt [A/μs]
Fig.  3 Reverse recovery time t rr
Fig.  4
Reverse recovery current I RM
1.0
0.8
of the body diode vs. di/dt
350
300
250
200
of the body diode vs. di/dt
V GS = 0 V
0.6
160 A
150
100 A
T J = -25°C
0.4
I F = 50 A
V R = 24 V
T J = 125°C
100
50
25°C
125°C
150°C
0.2
0
400
500
600
700
800
900 1000 1100
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
-di F /dt [A/μs]
V SD [V]
Fig.  5
V GS
Reverse recovery charge Q rr
of the body diode vs. di/dt
1.4
1.2
Fig.  6 Source drain diode current I F vs.
source drain voltage V SD (body diode)
0,9 V GS
1.0
V DS
I D
0,1 V GS
t
0.8
0,1 I D
0,9 I D
0,9 I D
0,1 I D
t
0.6
0.4
0.2
t d(on)
t r
t d(off)
t f
0.0
1
10
100
G WM  160-0055P3
1000
10000
Time - Seconds
Fig.  7
Definition of switching times
Fig.  8 Typ. thermal impedance junction to
heatsink Z thJH with heat transfer paste
IXYS reserves the right to change limits, test conditions and dimensions.
? 2006 IXYS All rights reserved
6-6
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