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| 型号： | HW-V5-ML555-G |
| 厂商： | Xilinx Inc |
| 文件页数： | 82/108页 |
| 文件大小： | 0K |
| 描述： | BOARD EVAL FOR VIRTEX-5 ML555 |
| 产品培训模块： | PCI Express and Virtex® -5 FPGAs |
| 标准包装： | 1 |
| 系列： | Virtex® -5 |
| 类型： | FPGA |
| 适用于相关产品： | Virtex?-5 FPGA |
| 所含物品： | 板，线缆，CD |
| 配用： | HW-AFX-SMA-SFP-ND - CONVERSION MODULE SMA - SFP HW-AFX-SMA-SATA-ND - CONVERSION MODULE SMA - SATA HW-AFX-SMA-RJ45-ND - CONVERSION MODULE SMA - RJ45 HW-AFX-SMA-HSSDC2-ND - CONVERSION MODULE SMA - HSSDC2 HW-AFX-BERG-EPHY-ND - DAUGHTER CARD PHY BERG-EPHY |
| 相关产品： | XC5VFX70T-1FF1136CES-ND - IC FPGAVIRTEX5FX ES 70K 1136FBGA XC5VLX85T-3FF1136C-ND - IC FPGA VIRTEX-5 85K 1136FBGA XC5VLX85T-2FF1136I-ND - IC FPGA VIRTEX-5 85K 1136FBGA XC5VLX85T-2FF1136C-ND - IC FPGA VIRTEX-5 85K 1136FBGA XC5VLX85T-1FF1136I-ND - IC FPGA VIRTEX-5 85K 1136FBGA XC5VLX85T-1FF1136C-ND - IC FPGA VIRTEX-5 85K 1136FBGA XC5VLX50T-3FF1136C-ND - IC FPGA VIRTEX-5 50K 1136FBGA XC5VLX50T-2FF1136I-ND - IC FPGA VIRTEX-5 50K 1136FBGA XC5VLX50T-2FF1136C-ND - IC FPGA VIRTEX-5 50K 1136FBGA XC5VLX50T-1FF1136I-ND - IC FPGA VIRTEX-5 50K 1136FBGA 更多... |
| 其它名称： | 122-1586 HW-V5-ML555-G-ND |
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Chapter 3: Hardware Description
R
GTP Transceiver Power
Three low drop-out (LDO) voltage regulators are provided for the analog voltage inputs to
the GTP transceivers. Each regulator has a voltage divider circuit that permits the voltage
to be adjusted, if required, simply by changing resistance value of the voltage divider. Each
regulator can source up to 4A of current. A single voltage regulator sources power to the
AVTTX, AVTRX, and VVTTRXC inputs of the GTP transceivers. The ML555 board does
not provide separate power supplies for the transmitter and receiver termination voltages.
The GTP transceiver analog power supplies are filtered in accordance with the Virtex-5
FPGA RocketIO GTP Transceiver User Guide . Eight of the 12 GTPs on the ML555 board are
specifically targeted solely for PCI Express applications.
DDR2 SODIMM Power
Power consumption for the DDR2 memory interface is dependent upon the density and
speed of the memory installed in the SODIMM socket. Table 3-35 shows approximate 1.8V
current consumption requirements by density and transfer rate for Micron Semiconductor
SODIMMs supported by the ML555 board. Memory data sheet specifications should be
consulted to determine specific power requirements for the SODIMM devices.
Higher densities and higher performance SODIMMs are supported, however, the user
must calculate total application power and stay within the PCI and or PCI Express add-in
card specifications.
Table 3-35:
DDR2 SODIMM Current Consumption versus Data Transfer Rate
Memory Density
128 MB
256 MB
512 MB
400 MT/s
480 mA
620 mA
720 mA
533 MT/s
720 mA
780 mA
780 mA
667 MT/s
860 mA
940 mA
1100 mA
Current consumption can be even higher than shown in Table 3-35 if the four memory
banks are interleaved in the DDR2 memory. Interleaving is accomplished by using the
BA[2:0] bank address as the least-significant column address bits to the DDR2 memory.
While interleaving does not increase memory performance, it increases power dissipation
and should be avoided for PCI Express and PCI bus applications where add-in card power
is limited by specification to 25W.
Power Supply Monitoring
The ML555 board provides capabilities to monitor and measure the voltage and current for
the FPGA internal voltage and all analog GTP voltage regulators. Figure 3-17 shows a
block diagram of the voltage sensing circuit. Only those supplies central to PCI Express
power functions are provided with power supply monitoring capabilities. A 10 m Ω Kelvin
resistor is placed in series between the regulated output and the load on the board. The
input and output port of the series resistor is routed to a header that can be connected to a
Volt-Ohm-Meter (VOM) to measure the voltage drop across the resistor. The current then
can be calculated dividing the voltage by 0.010 Ω . Power equals voltage times current.
82
Virtex-5 FPGA ML555 Development Kit
UG201 (v1.4) March 10, 2008
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