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参数资料
| 型号： | IDT70V3599S166DR |
| 厂商： | IDT, Integrated Device Technology Inc |
| 文件页数： | 19/23页 |
| 文件大小： | 0K |
| 描述： | IC SRAM 4MBIT 166MHZ 208QFP |
| 标准包装： | 6 |
| 格式 - 存储器： | RAM |
| 存储器类型： | SRAM - 双端口，同步 |
| 存储容量： | 4.5M（128K x 36） |
| 速度： | 166MHz |
| 接口： | 并联 |
| 电源电压： | 3.15 V ~ 3.45 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 208-BFQFP |
| 供应商设备封装： | 208-PQFP（28x28） |
| 包装： | 托盘 |
| 其它名称： | 70V3599S166DR |
IDT70V3599/89S
High-Speed 3.3V 128/64K x 36 Dual-Port Synchronous Static RAM
Functional Description
The IDT70V3599/89 provides a true synchronous Dual-Port Static
RAM interface. Registered inputs provide minimal set-up and hold times
on address, data, and all critical control inputs. All internal registers are
clocked on the rising edge of the clock signal, however, the self-timed
internal write pulse is independent of the LOW to HIGH transition of the clock
signal.
An asynchronous output enable is provided to ease asyn-
chronous bus interfacing. Counter enable inputs are also provided to stall
the operation of the address counters for fast interleaved
memory applications.
A HIGH on CE 0 or a LOW on CE 1 for one clock cycle will power down
the internal circuitry to reduce static power consumption. Multiple chip
enables allow easier banking of multiple IDT70V3599/89s for depth
expansion configurations. Two cycles are required with CE 0 LOW and
CE 1 HIGH to re-activate the outputs.
A 17 /A 16(1)
Industrial and Commercial Temperature Ranges
Depth and Width Expansion
The IDT70V3599/89 features dual chip enables (refer to Truth
Table I) in order to facilitate rapid and simple depth expansion with no
requirements for external logic. Figure 4 illustrates how to control the
various chip enables in order to expand two devices in depth.
The IDT70V3599/89 can also be used in applications requiring
expanded width, as indicated in Figure 4. Through combining the control
signals, the devices can be grouped as necessary to accommodate
applications needing 72-bits or wider.
IDT70V3599/89
CE 0
IDT70V3599/89
CE 0
Control Inputs
CE 1
V DD
Control Inputs
CE 1
V DD
IDT70V3599/89
CE 1
IDT70V3599/89
CE 1
Control Inputs
CE 0
Control Inputs
CE 0
BE ,
R/ W ,
OE ,
CLK,
NOTE:
1. A 17 is for IDT70V3599, A 16 is for IDT70V3589.
Figure 4. Depth and Width Expansion with IDT70V3599/89
19
6.42
5617 drw 20
ADS ,
REPEAT ,
CNTEN
相关PDF资料 |
PDF描述 |
|---|---|
| IDT70V3319S166PRF | IC SRAM 4MBIT 166MHZ 128TQFP |
| 356-006-525-101 | CARDEDGE 6POS .156 BLACK |
| 356-006-521-104 | CARDEDGE 6POS .156 BLACK |
| 356-006-521-102 | CARDEDGE 6POS .156 BLACK |
| 1-84953-8 | CONN FPC 18POS 1MM RT ANG SMD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| IDT70V3599S166DRG | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 4.5MBIT 166MHZ 208PQFP |
| IDT70V35L15PF | 功能描述:IC SRAM 144KBIT 15NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口，同步 存储容量:1.125M（32K x 36） 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA（17x17） 包装:带卷 (TR) 其它名称:70V3579S5BCI8 |
| IDT70V35L15PF8 | 功能描述:IC SRAM 144KBIT 15NS 100TQFP RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:45 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口，异步 存储容量:128K（8K x 16） 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP（14x14） 包装:托盘 其它名称:70V25S15PF |
| IDT70V35L15PFG | 功能描述:IC SRAM 144KBIT 15NS 100TQFP RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口，同步 存储容量:1.125M（32K x 36） 速度:5ns 接口:并联 电源电压:3.15 V ~ 3.45 V 工作温度:-40°C ~ 85°C 封装/外壳:256-LBGA 供应商设备封装:256-CABGA（17x17） 包装:带卷 (TR) 其它名称:70V3579S5BCI8 |
| IDT70V35L15PFG8 | 制造商:Integrated Device Technology Inc 功能描述:IC SRAM 144KBIT 15NS 100TQFP |
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