参数资料
型号: IDT70V5388S133BC8
厂商: IDT, Integrated Device Technology Inc
文件页数: 9/29页
文件大小: 0K
描述: IC SRAM 1.125MBIT 133MHZ 256BGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: SRAM - 四端口,同步
存储容量: 1.125M(64K x 18)
速度: 133MHz
接口: 并联
电源电压: 3.15 V ~ 3.45 V
工作温度: 0°C ~ 70°C
封装/外壳: 256-LBGA
供应商设备封装: 256-CABGA(17x17)
包装: 带卷 (TR)
其它名称: 70V5388S133BC8
IDT70V5388/78
3.3V 64/32K x 18 Synchronous FourPort? Static RAM
Industrial and Commercial Temperature Ranges
Absolute Maximum Ratings (1)
Symbol Rating Commercial
Unit
Capacitance (1)
(T A = +25°C, F = 1.0MH Z )
& Industrial
Symbol
Parameter
Conditions (2)
Max.
Unit
V TERM(2)
Terminal Voltage
-0.5 to +4.6
V
C IN
Input Capacitance
V IN = 3dV
8
pF
with Respect to GND
C OUT (3)
Output Capacitance
V OUT = 3dV
10.5
pF
T BIAS(3)
T STG
T JN
Temperature Under Bias
Storage Temperature
Junction Temperature
-55 to +125
-65 to +150
+150
o
o
o
C
C
C
5649 tbl 09
NOTES:
1. These parameters are determined by device characterization, but are not
production tested.
2. 3dV references the interpolated capacitance when the input and output switch
I OUT
DC Output Current
50
mA
from 0V to 3V or from 3V to 0V.
3. C OUT also references C I/O .
5623 tbl 06
NOTES:
1. Stresses greater than those listed under ABSOLUTE MAXIMUM RATINGS may
cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated
in the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect reliability.
2. V TERM must not exceed V DD + 150mV for more than 25% of the cycle time or
4ns maximum, and is limited to < 20mA for the period of V TERM > V DD + 150mV.
3. Ambient Temperature under DC Bias. No AC conditions. Chip Deselected.
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (V DD = 3.3V ± 150mV)
70V5388/78S
Input Leakage Current
JTAG Input Leakage Current
Output Leakage Current
Symbol
|I LI |
|I LI |
|I LO |
V OL
V OH
Parameter
(1)
(1)
Output Low Voltage
Output High Voltage
(1,2)
Test Conditions
V DD = Max., V IN = 0V to V DD
V DD = Max., V IN = 0V to V DD
V OUT = 0V to V DD, Outputs in tri-state mode
I OL = +4mA, V DD = Min.
I OH = -4mA, V DD = Min.
Min.
___
___
___
___
2.4
Max.
10
30
10
0.4
___
Unit
μA
μA
μA
V
V
NOTE:
1. At V DD < 2.0V leakages are undefined.
2. Applicable only for TMS, TDI and TRST inputs.
9
6.42
5649 tbl 10
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IDT70V5388S166BC8 功能描述:IC SRAM 1.125MBIT 166MHZ 256BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:3,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:8K (1K x 8) 速度:400kHz 接口:I²C,2 线串口 电源电压:1.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC(0.154",3.90mm 宽) 供应商设备封装:8-SOIC 包装:带卷 (TR)
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