参数资料
型号: IDT71V65903S80B
厂商: INTEGRATED DEVICE TECHNOLOGY INC
元件分类: SRAM
英文描述: 512K X 18 ZBT SRAM, 8 ns, PBGA119
封装: 14 X 22 MM, PLASTIC, MS-026AA, BGA-119
文件页数: 7/26页
文件大小: 972K
代理商: IDT71V65903S80B
6.42
IDT71V65703, IDT71V65903, 256K x 36, 512K x 18, 3.3V Synchronous ZBT SRAMs with
3.3V I/O, Burst Counter, and Flow-Through Outputs
Commercial and Industrial Temperature Ranges
15
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range (VDD = 3.3V±5%)
Figure 2. Lumped Capacitive Load, Typical Derating
Figure 1. AC Test Load
AC Test Load
AC Test Conditions
DC Electrical Characteristics Over the Operating
Temperature and Supply Voltage Range(1) (VDD = 3.3V±5%)
NOTE:
1. The
LBO pin will be internally pulled to VDD if it is not actively driven in the application and the ZZ pin will be internally pulled to VSS if not actively driven.
NOTES:
1. All values are maximum guaranteed values.
2. At f = fMAX, inputs are cycling at the maximum frequency of read cycles of 1/tCYC; f=0 means no input lines are changing.
3. For I/Os VHD = VDDQ – 0.2V, VLD = 0.2V. For other inputs VHD = VDD – 0.2V, VLD = 0.2V.
Symbol
Parameter
Test Conditions
Min.
Max.
Unit
|ILI|
Input Leakage Current
VDD = Max., VIN = 0V to VDD
___
5 A
|ILI|
LBO Input Leakage Current(1)
VDD = Max., VIN = 0V to VDD
___
30
A
|ILO|
Output Leakage Current
VOUT = 0V to VCC
___
5 A
VOL
Output Low Voltage
IOL = +8mA, VDD = Min.
___
0.4
V
VOH
Output High Voltage
IOH = -8mA, VDD = Min.
2.4
___
V
5298 tbl 21
Symbol
Parameter
Test Conditions
7.5ns
8ns
8.5ns
Unit
Com'l
Ind
Com'l
Ind
Com'l
Ind
IDD
Operating Power
Supply Current
Device Selected, Outputs Open,
ADV/
LD = X, VDD = Max.,
VIN > VIH or < VIL, f = fMAX(2)
275
295
250
60
225
60
mA
ISB1
CMOS Standby Power
Supply Current
Device Deselected, Outputs Open,
VDD = Max., VIN > VHD or < VLD,
f = 0(2,3)
40
60
40
60
40
60
mA
ISB2
Clock Running Power
Supply Current
Device Deselected, Outputs Open,
VDD = Max., VIN > VHD or < VLD,
f = fMAX(2,3)
105
125
100
120
95
115
mA
ISB3
Idle Power
Supply Current
Device Selected, Outputs Open,
CEN > VIH, VDD = Max.,
VIN > VHD or < VLD, f = fMAX(2,3)
40
60
40
60
40
60
mA
IZZ
Full Sleep Mode
Supply Current
Device Selected, Outputs Open,
CEN < VIL, VDD = Max., ZZ > VHD
VIN > VHD or < VLD, f = fMAX(2,3)
40
60
40
60
40
60
mA
5298 tbl 22
Input Pulse Levels
Input Rise/Fall Times
Input Timing Reference Levels
Output Reference Levels
Output Load
0 to 3V
2ns
1.5V
Figure 1
5298 tbl 23
VDDQ/2
50
I/O
Z0 =50
5298 drw 04
,
1
2
3
4
20 30 50
100
200
tCD
(Typical, ns)
Capacitance (pF)
80
5
6
5298 drw 05
,
相关PDF资料
PDF描述
IDT7210L25PQF 16-BIT, DSP-MULTIPLIER ACCUMULATOR/SUMMER, PQFP64
IDT7281L25SOI 512 X 9 OTHER FIFO, 25 ns, PDSO28
7200L20TDB 256 X 9 OTHER FIFO, 20 ns, CDIP28
IDT7281L25TPI 512 X 9 OTHER FIFO, 25 ns, PDIP28
IDT7284L20PAI 4K X 9 BI-DIRECTIONAL FIFO, 20 ns, PDSO56
相关代理商/技术参数
参数描述
IDT71V65903S80BG 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V65903S80BG8 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V65903S80BGI 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:45 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 双端口,异步 存储容量:128K(8K x 16) 速度:15ns 接口:并联 电源电压:3 V ~ 3.6 V 工作温度:0°C ~ 70°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:70V25S15PF
IDT71V65903S80BGI8 功能描述:IC SRAM 9MBIT 80NS 119BGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI
IDT71V65903S80BQ 功能描述:IC SRAM 9MBIT 80NS 165FBGA RoHS:否 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:72 系列:- 格式 - 存储器:RAM 存储器类型:SRAM - 同步 存储容量:9M(256K x 36) 速度:75ns 接口:并联 电源电压:3.135 V ~ 3.465 V 工作温度:-40°C ~ 85°C 封装/外壳:100-LQFP 供应商设备封装:100-TQFP(14x14) 包装:托盘 其它名称:71V67703S75PFGI