参数资料
型号: IDT79RC32H434-266BCG
厂商: IDT, Integrated Device Technology Inc
文件页数: 27/53页
文件大小: 0K
描述: IC MPU 32BIT CORE 266MHZ 256-BGA
标准包装: 90
系列: Interprise™
处理器类型: MIPS32 32-位
速度: 266MHz
电压: 1.2V
安装类型: 表面贴装
封装/外壳: 256-LBGA
供应商设备封装: 256-CABGA(17x17)
包装: 托盘
其它名称: 79RC32H434-266BCG
33 of 53
January 19, 2006
IDT RC32434
Figure 19 JTAG AC Timing Waveform
The IEEE 1149.1 specification requires that the JTAG and EJTAG TAP controllers be reset at power-up whether or not the interfaces are used for
a boundary scan or a probe. Reset can occur through a pull-down resistor on JTAG_TRST_N if the probe is not connected. However, on-chip pull-up
resistors are implemented on the RC32434 due to an IEEE 1149.1 requirement. Having on-chip pull-up and external pull-down resistors for the
JTAG_TRST_N signal requires special care in the design to ensure that a valid logical level is provided to JTAG_TRST_N, such as using a small
external pull-down resistor to ensure this level overrides the on-chip pull-up. An alternative is to use an active power-up reset circuit for
JTAG_TRST_N, which drives JTAG_TRST_N low only at power-up and then holds JTAG_TRST_N high afterwards with a pull-up resistor.
Figure 20 shows the electrical connection of the EJTAG probe target system connector.
Figure 20 Target System Electrical EJTAG Connection
Tpw_16d
Tdz_16c
Tdo_16c
Thld_16e
Tsu_16e
Thld_16b
Tsu_16b
Thld_16b
Tsu_16b
Tlow_16a
Tper_16a
Thigh_16a
JTAG_TCK
JTAG_TDI
JTAG_TMS
EJTAG_TMS
JTAG_TDO
JTAG_TRST_N
GND
1
GND
TRST*
TDI
TDO
TMS
TCK
RST*
DINT
JTAG_TRST_N
JTAG_TDI
JTAG_TDO
EJTAG_TMS
JTAG_TCK
GND
VDD
GND
VccIO voltage
reference
Pu
ll-
up
Pull-do
w
n
Series-res.
Reset (soft/hard)
Target System
Reset Circuit
Pu
ll-
up
Other reset
sources
VccIO
RC32434
no connect
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IDT79RC32H434-266BCGI 功能描述:IC MPU 32BIT CORE 266MHZ 256-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-266BCI 功能描述:IC MPU 32BIT CORE 266MHZ 256-BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-300BC 功能描述:IC MPU 32BIT CORE 300MHZ 256-BGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-300BCG 功能描述:IC MPU 32BIT CORE 300MHZ 256-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘
IDT79RC32H434-300BCGI 功能描述:IC MPU 32BIT CORE 300MHZ 256-BGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - 微处理器 系列:Interprise™ 标准包装:40 系列:MPC83xx 处理器类型:32-位 MPC83xx PowerQUICC II Pro 特点:- 速度:267MHz 电压:0.95 V ~ 1.05 V 安装类型:表面贴装 封装/外壳:516-BBGA 裸露焊盘 供应商设备封装:516-PBGAPGE(27x27) 包装:托盘