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参数资料
型号： IDT82V3280DQG
厂商： INTEGRATED DEVICE TECHNOLOGY INC
元件分类： 通信及网络
英文描述： WAN PLL
中文描述： SPECIALTY TELECOM CIRCUIT, PQFP100
封装： GREEN, TQFP-100
文件页数： 149/167页
文件大小： 1039K
代理商： IDT82V3280DQG
IDT82V3280
WAN PLL
Thermal Management
149
June 19, 2006
8
THERMAL MANAGEMENT
The device operates over the industry temperature range -40°C ~
+85°C. To ensure the functionality and reliability of the device, the maxi-
mum junction temperature T
jmax
should not exceed 125°C. In some
applications, the device will consume more power and a thermal solution
should be provided to ensure the junction temperature T
j
does not
exceed the T
jmax
.
8.1
JUNCTION TEMPERATURE
Junction temperature T
j
is the temperature of package typically at the
geographical center of the chip where the device's electrical circuits are.
It can be calculated as follows:
Equation 1: T
j
= T
A
+ P X
θ
JA
Where:
θ
JA
= Junction-to-Ambient Thermal Resistance of the Package
T
j
= Junction Temperature
T
A
= Ambient Temperature
P = Device Power Consumption
In order to calculate junction temperature, an appropriate
θ
JA
must
be used. The
θ
JA
is shown in
Table 44
:
Power consumption is the core power excluding the power dissipated
in the loads.
Table 43
provides power consumption in special environ-
ments.
8.2
EXAMPLE OF JUNCTION TEMPERATURE
CALCULATION
Assume:
T
A
= 85°C
θ
JA
= 18.5°C/W (TQFP/DQ100 Soldered & when airfow rate is 0 m/s)
P = 1.9W
The junction temperature T
j
can be calculated as follows:
T
j
= T
A
+ P X
θ
JA
= 85°C + 1.9W X 18.5°C/W = 120.2°C
The junction temperature of 120.2°C is below the maximum junction
temperature of 125°C so no extra heat enhancement is required.
In some operation environments, the calculated junction temperature
might exceed the maximum junction temperature of 125°C and an exter-
nal thermal solution such as a heatsink is required.
8.3
HEATSINK EVALUATION
A heatsink is expanding the surface area of the device to which it is
attached.
θ
JA
is now a combination of device case and heat-sink thermal
resistance, as the heat flowing from the die junction to ambient goes
through the package and the heatsink.
θ
JA
can be calculated as follows:
Equation 2:
θ
JA
=
θ
JC
+
θ
HA
Where:
θ
JC
= Junction-to-Case (Heatsink) Thermal Resistance
θ
HA
= Heatsink-to-Ambient Thermal Resistance
θ
HA
determines which heatsink can be selected to ensure the junc-
tion temperature does not exceed the maximum junction temperature.
According to Equation 1 and 2, the heatsink-to-ambient thermal resis-
tance
θ
HA
can be calculated as follows:
Equation 3:
θ
HA
= (T
j
- T
A
) / P -
θ
JC
Assume:
T
j
= 125°C (T
jmax
)
T
A
= 85°C
P = 1.9W
θ
JC
= 10.8°C/W (TQFP/DQ100)
The heatsink-to-ambient thermal resistance
θ
HA
can be calculated
as follows:
θ
HA
= (125°C - 85°C ) / 1.9W - 10.8°C/W = 10.3°C/W
That is, if a heatsink whose heatsink-to-ambient thermal resistance
θ
HA
is below or equal to 10.3°C/W is used in such operation environ-
ment, the junction temperature will not exceed the maximum junction
temperature.
Table 43: Power Consumption and Maximum Junction Temperature
Package
Power
Consumption (W)
Operating
Voltage
(V)
T
A
(°C)
Maximum
Junction
Temperature (°C)
TQFP/PN100
TQFP/DQ100
1.9
1.9
3.6
3.6
85
85
125
125
Table 44: Thermal Data
Package
Pin Count
Thermal Pad
θ
JC
(°C/W)
θ
JB
(°C/W)
θ
JA
(°C/W) Air Flow in m/s
0
1
2
3
4
5
TQFP/PN100
TQFP/DQ100
TQPF/DQ100
100
100
100
No
11.0
10.8
10.8
34.2
23.7
3.0
39.3
27.2
18.5
36.2
24.7
15.4
34.3
23.3
13.9
33.5
22.4
13.1
32.9
21.9
12.6
32.6
21.5
12.2
Yes/Exposed
Yes/Soldered
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