参数资料
型号: IRF7307
厂商: International Rectifier
英文描述: Power MOSFET
中文描述: 功率MOSFET
文件页数: 1/10页
文件大小: 194K
代理商: IRF7307
IRF7307
HEXFET Power MOSFET
PD - 9.1242B
8/25/97
l Generation V Technology
l Ultra Low On-Resistance
l Dual N and P Channel Mosfet
l Surface Mount
l Available in Tape & Reel
l Dynamic dv/dt Rating
l Fast Switching
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve the
lowest possible on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient device for use in a wide
variety of applications.
The SO-8 has been modified through a customized
leadframe for enhanced thermal characteristics and
multiple-die capability making it ideal in a variety of
power applications. With these improvements, multiple
devices can be used in an application with dramatically
reduced board space. The package is designed for
vapor phase, infra red, or wave soldering techniques.
Power dissipation of greater than 0.8W is possible in
a typical PCB mount application.
D1
N -C H AN N EL M O SF ET
P-CH ANNE L M OS FE T
D1
D2
G1
S2
G2
S1
To p V ie w
8
1
2
3
4
5
6
7
SO-8
Description
N-Ch
P-Ch
VDSS
20V
-20V
RDS(on) 0.050 0.090
Max.
N-Channel
P-Channel
ID @ TA = 25°C
10 Sec. Pulse Drain Current, VGS @ 4.5V
5.7
-4.7
ID @ TA = 25°C
Continuous Drain Current, VGS @ 4.5V
5.2
-4.3
ID @ TA = 70°C
Continuous Drain Current, VGS @ 4.5V
4.1
-3.4
IDM
Pulsed Drain Current
21
-17
PD @TA = 25°C
Power Dissipation
2.0
W
Linear Derating Factor
0.016
W/°C
VGS
Gate-to-Source Voltage
± 12
V
dv/dt
Peak Diode Recovery dv/dt
5.0
-5.0
V/ns
TJ,TSTG
Junction and Storage Temperature Range
-55 to + 150
°C
Parameter
Units
A
Absolute Maximum Ratings
Thermal Resistance Ratings
Parameter
Typ.
Max.
Units
RθJA
Maximum Junction-to-Ambient
–––
62.5
°C/W
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