参数资料
型号: ISL95874IRUZ-T
厂商: Intersil
文件页数: 10/29页
文件大小: 0K
描述: IC CTRLR PWM 1PHASE GPU 16UTQFN
标准包装: 3,000
应用: 控制器,GPU 内核电源
输入电压: 3.3 V ~ 25 V
输出数: 1
输出电压: 0.5 V ~ 5 V
工作温度: -40°C ~ 100°C
安装类型: 表面贴装
封装/外壳: 16-UFQFN 裸露焊盘
供应商设备封装: 16-UTQFN(2.6x1.8)
包装: 带卷 (TR)
ISL95874, ISL95875, ISL95876
Ordering Information
PART NUMBER
(Note 4)
ISL95874HRUZ-T (Notes 1, 3)
ISL95875HRUZ-T (Notes 1, 3)
874
875
PART
MARKING
TEMP RANGE
(°C)
-10 to +100
-10 to +100
PACKAGE
(Pb-Free)
16 Ld 2.6x1.8 UTQFN
20 Ld 3.2x1.8 UTQFN
PKG.
DWG. #
L16.2.6x1.8A
L20.3.2x1.8
Coming Soon
ISL95876HRZ (Note 2)
876
-10 to +100
20 Ld 3x4 QFN
L20.3x4
Coming Soon
ISL95876HRZ-T (Notes 1, 2)
ISL95874IRUZ-T (Notes 1, 3)
ISL95875IRUZ-T (Notes 1, 3)
876
74I
75I
-10 to +100
-40 to +100
-40 to +100
20 Ld 3x4 QFN
16 Ld 2.6x1.8 UTQFN
20 Ld 3.2x1.8 UTQFN
L20.3x4
L16.2.6x1.8A
L20.3.2x1.8
Coming Soon
ISL95876IRZ (Note 2)
870I
-40 to +100
20 Ld 3x4 QFN
L20.3x4
Coming Soon
ISL95876IRZ-T (Notes 1, 2)
870I
-40 to +100
20 Ld 3x4 QFN
L20.3x4
NOTES:
1. Please refer to TB347 for details on reel specifications.
2. These Intersil Pb-free plastic packaged products employ special Pb-free material sets, molding compounds/die attach materials, and 100% matte
tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil
Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
3. These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and NiPdAu plate
- e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
4. For Moisture Sensitivity Level (MSL), please see device information page for ISL95874 , ISL95875 , ISL95876. For more information on MSL please
see techbrief TB363 .
10
FN7933.1
March 2, 2012
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