参数资料
型号: LTC3615EUF#PBF
厂商: Linear Technology
文件页数: 30/32页
文件大小: 0K
描述: IC REG BUCK SYNC ADJ 3A DL 24QFN
标准包装: 91
类型: 降压(降压)
输出类型: 可调式
输出数: 2
输出电压: 0.6 V ~ 5.5 V
输入电压: 2.25 V ~ 5.5 V
PWM 型: 电流模式,混合
频率 - 开关: 400kHz ~ 4MHz
电流 - 输出: 3A
同步整流器:
工作温度: -40°C ~ 125°C
安装类型: 表面贴装
封装/外壳: 24-WFQFN 裸露焊盘
包装: 管件
供应商设备封装: 24-QFN 裸露焊盘(4x4)
LTC3615/LTC3615-1
PACKAGE DESCRIPTION
UF Package
DWG #
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC UF Package 05-08-1697 Rev B)
24-Lead Plastic QFN (4mm × 4mm)
(Reference LTC DWG # 05-08-1697 Rev B)
0.70 ±0.05
4.50 ±0.05 2.45 ±0.05
3.10 ±0.05 (4 SIDES)
PACKAGE OUTLINE
0.25 ±0.05
0.50 BSC
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
4.00 ±0.10
(4 SIDES)
PIN 1
TOP MARK
(NOTE 6)
0.75 ±0.05
BOTTOM VIEW—EXPOSED PAD
R = 0.115
TYP
23 24
PIN 1 NOTCH
R = 0.20 TYP OR
0.35 × 45° CHAMFER
0.40 ±0.10
1
2
2.45 ±0.10
(4-SIDES)
(UF24) QFN 0105 REV B
0.200 REF
0.00 – 0.05
NOTE:
1. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE, IF PRESENT
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
0.25 ±0.05
0.50 BSC
30
For more information www.linear.com/LTC3615
3615fb
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