参数资料
型号: M1A3PE3000-FGG896I
厂商: Microsemi SoC
文件页数: 139/162页
文件大小: 0K
描述: IC FPGA 1KB FLASH 3M 896-FBGA
标准包装: 27
系列: ProASIC3E
RAM 位总计: 516096
输入/输出数: 620
门数: 3000000
电源电压: 1.425 V ~ 1.575 V
安装类型: 表面贴装
工作温度: -40°C ~ 85°C
封装/外壳: 896-BGA
供应商设备封装: 896-FBGA(31x31)
ProASIC3E DC and Switching Characteristics
2-64
Revision 13
Figure 2-35 Timing Model and Waveforms
tPD
A
B
tPD = MAX(tPD(RR), tPD(RF), tPD(FF), tPD(FR))
where edges are applicable for the particular
combinatorial cell
Y
NAND2 or
Any Combinatorial
Logic
tPD
50%
VCC
50%
GND
A, B, C
50%
(RR)
(RF)
GND
OUT
GND
50%
(FF)
(FR)
tPD
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