参数资料
型号: MAX5073ETI+T
厂商: Maxim Integrated Products
文件页数: 23/25页
文件大小: 0K
描述: IC REG BUCK BST ADJ 1A/2A 28TQFN
产品培训模块: Lead (SnPb) Finish for COTS
Obsolescence Mitigation Program
标准包装: 2,500
类型: 降压(降压),升压(升压)
输出类型: 可调式
输出数: 2
输出电压: 0.8 V ~ 28 V
输入电压: 4.5 V ~ 23 V
PWM 型: 电压模式
频率 - 开关: 200kHz ~ 2.2MHz
电流 - 输出: 1A,2A
同步整流器:
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 28-WFQFN 裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 28-TQFN-EP(5x5)
2.2MHz, Dual-Output Buck or Boost Converter
with Internal Power MOSFETs
Layout Procedure
1) Place the power components first, with ground ter-
minals adjacent (inductor, C IN_ , and C OUT_ ). Make
all these connections on the top layer with wide,
copper-filled areas (2oz copper recommended).
2) Group the gate-drive components (bootstrap
diodes and capacitors, and VL bypass capacitor)
together near the controller IC.
3) Make the DC-DC controller ground connections as
follows:
Ordering Information (continued)
a) Create a small-signal ground plane underneath
the IC.
b) Connect this plane to SGND and use this plane
for the ground connection for the reference
(BYPASS), enable, compensation components,
feedback dividers, and OSC resistor.
c) Connect SGND and PGND together near the
input bypass capacitors and the IC (this is the
only connection between SGND and PGND).
Chip Information
PART
MAX5073ATI
TEMP RANGE
-40 ° C to +125 ° C
PIN-PACKAGE
28 Thin QFN-EP*
(5mm x 5mm)
PKG
CODE
T2855-6
TRANSISTOR COUNT: 5994
PROCESS: BiCMOS
MAX5073ATI+ -40 ° C to +125 ° C
* EP = Exposed pad.
+ Denotes lead-free package.
28 Thin QFN-EP*
(5mm x 5mm)
T2855-6
______________________________________________________________________________________
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