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| 型号： | MAX5951ETJ+T |
| 厂商： | Maxim Integrated Products |
| 文件页数： | 19/25页 |
| 文件大小： | 0K |
| 描述： | IC REG CTRLR BUCK PWM VM 32-TQFN |
| 产品培训模块： | Lead (SnPb) Finish for COTS Obsolescence Mitigation Program |
| 标准包装： | 2,500 |
| PWM 型： | 电压模式 |
| 输出数： | 1 |
| 频率 - 最大： | 1MHz |
| 占空比： | 88% |
| 电源电压： | 4.5 V ~ 16 V |
| 降压： | 是 |
| 升压： | 无 |
| 回扫： | 无 |
| 反相： | 无 |
| 倍增器： | 无 |
| 除法器： | 无 |
| Cuk： | 无 |
| 隔离： | 无 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 32-WFQFN 裸露焊盘 |
| 包装： | 带卷 (TR) |
12V/5V Input Buck PWM Controller
PWM Controller
Applications Information
Power Dissipation
The 32-pin TQFN thermally enhanced package can dis-
sipate 2.7W. Calculate power dissipation in the
MAX5951 as a product of the input voltage and the
total REG output current (I REG ). I REG includes quies-
cent current (I Q ) and gate drive current (I DREG ):
P D = V IN x I REG
I REG = I Q + [f SW x (Q G1 + Q G2 )]
where Q G1 and Q G2 are the total gate charge of the
low-side and high-side external MOSFETs. f SW is the
switching frequency of the converter, and I Q is the qui-
escent current of the device at the switching frequency.
Use the following equation to calculate the maximum
power dissipation (P DMAX ) in the chip at a given ambi-
ent temperature (T A ):
P DMAX = 34.5 x (150 - T A )
PC Board Layout Guidelines
Use the following guidelines to lay out the switching
voltage regulator:
1) Place the IN and DREG bypass capacitors close to
the MAX5951 PGND pin. Place the REG bypass
capacitor close to the AGND pin.
2) Minimize the area and length of the high-current
loops from the input capacitor, upper switching
MOSFET, inductor, and output capacitor back to
the input capacitor negative terminal.
3) Keep short the current loop formed by the synchro-
nous switching MOSFET, inductor, and output
capacitor.
4) Keep AGND and PGND isolated and connect them
at one single point close to the negative terminal of
the input filter capacitor.
5) Run the current-sense lines CS+ and CS- close to
each other to minimize the loop area.
6) Avoid long traces between the REG/DREG bypass
capacitors, driver output of the MAX5951, MOSFET
gates, and PGND. Minimize the loop formed by the
REG bypass capacitors, bootstrap diode, bootstrap
capacitor, the MAX5951, and the upper MOSFET gate.
7) Place the bank of output capacitors close to the
load.
8) Distribute the power components evenly across the
board for proper heat dissipation.
9) Provide enough copper area at and around the
switching MOSFETs and inductor to aid in thermal
dissipation.
10) Use 2oz copper to keep the trace inductance and
resistance to a minimum. Thin copper PC boards
can compromise efficiency since high currents are
involved in the application. Also, thicker copper
conducts heat more effectively, thereby reducing
thermal impedance.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MAX5952AEAX+ | 功能描述:热插拔功率分布 Quad PSE Controller for POE RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MAX5952AEAX+CK8 | 功能描述:热插拔功率分布 Quad PSE Controller for POE RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MAX5952AEAX+T | 功能描述:热插拔功率分布 Quad PSE Controller for POE RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MAX5952AEVCMAXQU | 功能描述:热插拔功率分布 Evaluation Kit/Evaluation System for the MAX5952A RoHS:否 制造商:Texas Instruments 产品:Controllers & Switches 电流限制: 电源电压-最大:7 V 电源电压-最小:- 0.3 V 工作温度范围: 功率耗散: 安装风格:SMD/SMT 封装 / 箱体:MSOP-8 封装:Tube |
| MAX5952AEVKIT | 功能描述:电源管理IC开发工具 Evaluation Kit/Evaluation System for the MAX5952A RoHS:否 制造商:Maxim Integrated 产品:Evaluation Kits 类型:Battery Management 工具用于评估:MAX17710GB 输入电压: 输出电压:1.8 V |
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