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| 型号： | MC33580BAPNAR2 |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 5/38页 |
| 文件大小： | 0K |
| 描述： | IC SW QUAD HI SIDE 15MOHM 24PQFN |
| 标准包装： | 1,200 |
| 类型： | 高端 |
| 输入类型： | SPI |
| 输出数： | 4 |
| 导通状态电阻： | 15 毫欧 |
| 电源电压： | 6 V ~ 27 V |
| 工作温度： | -40°C ~ 125°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-PowerQFN |
| 供应商设备封装： | 24-PQFN（12x12） |
| 包装： | 带卷 (TR) |
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ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
Table 2. Maximum Ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or
permanent damage to the device.
Ratings
Symbol
Value
Unit
ELECTRICAL RATINGS
Operating Voltage Range
Steady-State
V PWR(SS)
-16 to 41
V
V DD Supply Voltage
V DD
-0.3 to 5.5
V
Input / Output Voltage (1)
See note
(1)
- 0.3 to 7.0
V
SO Output Voltage (1)
WAKE Input Clamp Current
CSNS Input Clamp Current
HS [0:3] Voltage
Positive
Negative
V SO
I CL(WAKE)
I CL(CSNS)
V HS
- 0.3 to V DD + 0.3
2.5
10
41
-16
V
mA
mA
V
Output Current
(2)
I HS[0:3]
22.8
A
Output Clamp Energy
(4)
ESD Voltage
(3)
E CL [0:3]
0.2
J
V
Human Body Model (HBM)
Charge Device Model (CDM)
Corner Pins (1, 13, 19, 21)
All Other Pins (2-12, 14-18, 20, 22-24)
THERMAL RATINGS
Operating Temperature
Ambient
Junction
V ESD1
V ESD2
T A
T J
± 2000
± 750
± 500
- 40 to 125
- 40 to 150
° C
Storage Temperature
T STG
- 55 to 150
° C
Thermal Resistance
Junction to Case
(5)
R θ JC
<1.0
° C/ W
Junction to Ambient
R θ JA
30
Peak Pin Reflow Temperature During Solder Mounting
(6)
T SOLDER
245
° C
Notes
1. Exceeding voltage limits on IN[0:3], RST , FSI, CSNS, TEMP, SI, SO, SCLK, CS , or FS pins may cause a malfunction or permanent
damage to the device.
2. Continuous high-side output current rating so long as maximum junction temperature is not exceeded. Calculation of maximum output
current using package thermal resistance is required.
3. Active clamp energy using single-pulse method (L = 2 mH, R L = 0 ? , V PWR = 14 V, T J = 150 ° C initial).
4.
5.
6.
ESD testing is performed in accordance with the Human Body Model (HBM) (C ZAP = 100 pF, R ZAP = 1500 ? ), the Machine Model (MM)
(C ZAP = 200 pF, R ZAP = 0 ? ), and the Charge Device Model (CDM), Robotic (C ZAP = 4.0pF).
Device mounted on a 2s2p test board per JEDEC JESD51-2.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
33580
Analog Integrated Circuit Device Data
Freescale Semiconductor
5
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