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参数资料
型号： MCF54418CMJ250
厂商： FREESCALE SEMICONDUCTOR INC
元件分类： 微控制器/微处理器
英文描述： MICROPROCESSOR, PBGA256
封装： 12 X 12 MM, ROHS COMPLAINT, MAPBGA-256
文件页数： 54/60页
文件大小： 1107K
代理商： MCF54418CMJ250
MCF5441x ColdFire Microprocessor Data Sheet, Rev. 6
Preliminary—Subject to Change Without Notice
Revision history
Freescale Semiconductor
58
7
Revision history
Table 43 summarizes revisions to this document.
Table 43. Revision history
Rev. No.
Date
Summary of changes
2
10 Jun 2009 In Section 2.2, “Supply voltage sequencing” added the following note:
NOTE
All I/O VDD pins must be powered on when the device is functioning,
except when in standby mode.
In standby mode, all I/O VDD pins, except VSTBY_RTC (battery), can
be switched off.
Added Section 3.2, “Pinout—169 MAPBGA” and Section 3.3, “Pinout—256 MAPBGA” and updated Table 5 with
pin locations.
In Section 4.1, “Absolute maximum ratings”:
Added USB OTG, USB host, ADC, DAC/ADC, and RTC standby supply voltages
In Section 4.5, “DC electrical specifications”:
Added RTC standby supply voltage
Split out Power Supplies and I/O Characteristics to two separate tables
In Section 4.10, “FlexBus timing specifications”:
Changed maximum frequency to 100MHz and updated specs throughout the table
Changed FB2 maximum from 5 to 6
Added notes to Figure 11 and Figure 12
In Section 4.12, “DDR SDRAM controller timing specifications”:
Changed minimum frequency from 50 to 100
Changed maximum DD1 from 20 to 10
Changed DD5 from 2 to 0.5 x tSDCK – 1
Changed DD6 from 1.2 x tSDCK to WL + 0.2 x tSDCK
Changed DD7 from 1.5 to 0.7
Changed DD8 from 1.0 to 0.7
Changed DD9 from 1.0 to 0.5
Changed DD10 from 0.25 x tSDCK + 0.5 to 0.375 x tSDCK
In Section 4.17, “SSI timing specifications”:
Changed S7, S9, S15, and S17 from 10 to 15
In Section 4.22.2, “Transmit signal timing specifications”:
Changed E5 for MII from 5 to 4
In Section 4.20, “mcPWM timing specifications”:
Changed G2 from 2 to 1
In Section 4.24, “DSPI timing specifications”:
Changed DS3 from (2 x 1/fsys) – 2.0 to (tsck 2) – 2.0
Changed DS4 from (2 x 1/fsys) – 3.0 to (tsck 2) – 3.0
Changed DS7 from 7 to 6
Changed DS11 from 4 to 12
In Section 4.25, “SBF timing specifications”:
Changed SB5 maximum from 5 to 3
Changed SB6 minimum from –5 to 5
In Section 4.26, “1-Wire timing specifications”:
Added link to 1-wire specs
In Section 4.27, “General purpose I/O timing specifications”:
Changed G2 from 1.5 to 1
In Section 4.28, “Rapid general purpose I/O timing specifications”:
Changed RG1 from 3 to 6
Changed RG2 from 1.5 to 0.5
Changed RG3 from 3 to 6
In Section 4.29, “JTAG and boundary scan timing specifications”:
Changed J9-12 and J14 from TBD
In Section 4.30, “Debug AC timing specifications”:
Changed D2 from 1.5 to 0.5
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相关代理商/技术参数
参数描述
MCF54418CMJ250 制造商:Freescale Semiconductor 功能描述:IC 32-BIT MPU COLDFIRE 250MHZ 256-MA
MCF5441X 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:MCF5441x ColdFire Microprocessor Data Sheet
MCF54450 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:ColdFire㈢ Microprocessor
MCF54450ACVM180 制造商:Freescale Semiconductor 功能描述:MCF5445X RISC 32-BIT 180MHZ 1.8V/2.5V/3.3V 256-PIN MA-BGA BR - Trays 制造商:Freescale Semiconductor 功能描述:MCF5445X V4M CORE, MMU, 制造商:Freescale 功能描述:MPU MCF5445X RISC 32-Bit 180MHz 1.8V/2.5V/3.3V 256-Pin MAP-BGA Brick
MCF54450AVM240 制造商:Freescale Semiconductor 功能描述:MCF5445X RISC 32-BIT 240MHZ 1.8V/2.5V/3.3V 256-PIN MA-BGA BR - Trays
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