参数资料
| 型号： | MIC3001BML TR |
| 厂商： | Micrel Inc |
| 文件页数： | 14/76页 |
| 文件大小： | 0K |
| 描述： | IC FOM MANAGEMENT W/CALIBR 24MLF |
| 标准包装： | 1,000 |
| 类型： | 收发器 |
| 规程： | SDHj Sonet |
| 电源电压： | 3 V ~ 3.6 V |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 24-VFQFN 裸露焊盘，24-MLF? |
| 供应商设备封装： | 24-MLF?（4x4） |
| 包装： | 带卷 (TR) |
| 其它名称： | MIC3001BMLTR MIC3001BMLTR-ND |
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Micrel, Inc.
MIC3001
August 2004
21
M9999-082404-A
hbwhelp@micrel.com or (408) 955-1690
Address(s)
Field
Size
HEX
DEC
Name
Description
48-49
72-73
2
RESERVED
Reserved. (There is no slope for temperature.) Do not write; reads undefined.
4A-4B
74-75
2
TOFFh:TOFFl
Temperature offset; signed fixed point; LSB is always zero; MSB is at lower
physical address.
4C-4D
76-77
2
VSLPh:VSLPl
Voltage slope; unsigned fixed-point; MSB is at lower physical address.
4E-4F
78-79
2
VOFFh:VOFFl
Voltage offset; signed fixed point; MSB is at lower physical address.
50-61
80-81
2
ISLPh:ISLPl
Bias current slope; unsigned fixed-point; MSB is at lower physical address.
52-63
82-83
2
IOFFh:IOFFl
Bias current offset; signed fixed point; MSB is at lower physical address.
54-65
84-85
2
TXSLPh: TXSLPl
TX power slope; unsigned fixed-point; MSB is at lower physical address.
56-67
86-87
2
TXOFFh: TXOFFl
TX power offset; signed fixed point; MSB is at lower physical address.
Table 8. Internal Calibration Coefficient Memory Map – Part I
Address(s)
Field
Size
HEX
DEC
Name
Description
28-29
40-41
2
RXSLP0h:
RXSLP0l
RX power slope 0; unsigned fixed-point; MSB is at lower physical address.
2A-2B
42-43
2
RXOFF0h:
RXOFF0l
RX power offset 0; signed twos-complement; MSB is at lower physical
address.
2C-2D
44-45
2
RXSLP1h:
RXSLP1l
RX power slope 1; unsigned fixed-point; MSB is at lower physical address.
2E-2F
46-47
2
RXOFF1h:
RXOFF1l
RX power offset 1; signed twos-complement; MSB is at lower physical
address.
30-31
48-49
2
RXSLP2h:
RXSLP2l
RX power slope 2; unsigned fixed-point; MSB is at lower physical address.
32-33
50-51
2
RXOFF2h:
RXOFF2l
RX power offset 2; signed twos-complement; MSB is at lower physical
address.
34-35
52-53
2
RXSLP3h:
RXSLP3l
RX power slope 3; unsigned fixed-point; MSB is at lower physical address.
36-37
54-55
2
RXOFF3h:
RXOFF3l
RX power offset 3; signed twos-complement; MSB is at lower physical
address.
38-39
56-57
2
RXSLP4h:
RXSLP4l
RX power slope 4; unsigned fixed-point; MSB is at lower physical address.
3A-3B
58-59
2
RXOFF4h:
RXOFF4l
RX power offset 4; signed twos-complement; MSB is at lower physical
address.
3C-3D
60-61
2
RXSLP5h:
RXSLP5l
RX power slope 5; unsigned fixed-point; MSB is at lower physical address.
3E-3F
62-63
2
RXOFF5h:
RXOFF5l
RX power offset 5; signed twos-complement; MSB is at lower physical
address.
40-41
64-65
2
RXSLP6h:
RXSLP6l
RX power slope 6; unsigned fixed-point; MSB is at lower physical address.
42-43
66-67
2
RXOFF6h:
RXOFF6l
RX power offset 6; signed twos-complement; MSB is at lower physical
address.
44-45
68-69
2
RXOFF7h:
RXOFF7l
RX power slope 7; signed twos-complement; MSB is at lower physical
address.
46-47
70-71
2
RXSLP7h:
RXSLP7l
RX power slope 7; signed fixed-point; MSB is at lower physical address.
Table 9. Internal Calibration Coefficient Memory Map – Part II
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| MIC3001GML | 功能描述:网络控制器与处理器 IC F/O Transceiver Mgt. IC with Internal Calibration RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
| MIC3001GML TR | 功能描述:网络控制器与处理器 IC F/O Transceiver Mgt. IC with Internal Calibration RoHS:否 制造商:Micrel 产品:Controller Area Network (CAN) 收发器数量: 数据速率: 电源电流（最大值）:595 mA 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:PBGA-400 封装:Tray |
| MIC3001GMLTR | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:FOM Management IC with Internal Calibration |
| MIC3002 | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:FOM Management IC with Internal Calibr ation |
| MIC3002_10 | 制造商:MICREL 制造商全称:Micrel Semiconductor 功能描述:FOM Management IC with Internal Calibration |
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