参数资料
型号: MM908E621ACDWBR2
厂商: Freescale Semiconductor
文件页数: 58/60页
文件大小: 0K
描述: IC SW QUAD HB/TRPL HISID 54-SOIC
标准包装: 1,000
应用: 自动镜像控制
核心处理器: HC08
程序存储器类型: 闪存(16 kB)
控制器系列: 908E
RAM 容量: 512 x 8
接口: SCI,SPI
输入/输出数: 12
电源电压: 9 V ~ 16 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 54-BSSOP(0.295",7.50mm 宽)裸露焊盘
包装: 带卷 (TR)
供应商设备封装: 54-SOICW-EP
Analog Integrated Circuit Device Data
Freescale Semiconductor
7
908E621
ELECTRICAL CHARACTERISTICS
MAXIMUM RATINGS
THERMAL RATINGS
Operating Ambient Temperature(3)
TA
-40 to 85
°C
Operating Junction Temperature(4)
TJ
-40 to 125
°C
Storage Temperature
TSTG
-40 to 150
°C
Peak Package Reflow Temperature During Reflow(5), (6)
TPPRT
°C
Notes
3.
The limiting factor is junction temperature; taking into account the power dissipation, thermal resistance, and heat sinking.
4.
The temperature of analog and MCU die is strongly linked via the package, but can differ in dynamic load conditions, usually because
of higher power dissipation on the analog die. The analog die temperature must not exceed 150 °C under these conditions.
5.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may
cause malfunction or permanent damage to the device.
6.
Table 2. Maximum Ratings (continued)
All voltages are with respect to ground, unless otherwise noted. Exceeding limits on any pin may cause permanent damage
to the device.
Rating
Symbol
Value
Unit
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