参数资料
型号: MM908E625ACEK
厂商: Freescale Semiconductor
文件页数: 8/49页
文件大小: 0K
描述: IC HALF-BRIDGE QUAD 54-SOIC
标准包装: 26
应用: 自动镜像控制
核心处理器: HC08
程序存储器类型: 闪存(16 kB)
控制器系列: 908E
RAM 容量: 512 x 8
接口: SCI,SPI
输入/输出数: 13
电源电压: 8 V ~ 18 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 54-BSSOP(0.295",7.50mm 宽)裸露焊盘
包装: 管件
供应商设备封装: 54-SOICW-EP
Analog Integrated Circuit Device Data
16
Freescale Semiconductor
908E625
FUNCTIONAL DESCRIPTION
FUNCTIONAL PIN DESCRIPTION
ADC and should be tied to the same potential as VSS via
separate traces.
For details refer to the 68HC908EY16 datasheet.
ADC SUPPLY PINS (VDDA AND VSSA)
VDDA and VSSA are the power supply pins for the analog-
to-digital converter (ADC). It is recommended that a high
quality ceramic decoupling capacitor be placed between
these pins.
Important VDDA is the supply for the ADC and should be
tied to the same potential as EVDD via separate traces.
VSSA is the ground pin for the ADC and should be tied to the
same potential as EVSS via separate traces.
For details refer to the 68HC908EY16 datasheet.
MCU POWER SUPPLY PINS (EVDD AND EVSS)
EVDD and EVSS are the power supply and ground pins.
The MCU operates from a single power supply.
Fast signal transitions on MCU pins place high, short
duration current demands on the power supply. To prevent
noise problems, take special care to provide power supply
bypassing at the MCU.
For details refer to the 68HC908EY16 datasheet.
TEST PIN (FLSVPP)
This pin is for test purposes only. This pin should be either
left open (not connected) or connected to GND.
EXPOSED PAD PIN
The exposed pad pin on the bottom side of the package
conducts heat from the chip to the PCB board. For thermal
performance the pad must be soldered to the PCB board. It
is recommended that the pad be connected to the ground
potential.
相关PDF资料
PDF描述
MM908E624ACEW IC SWITCH TRIPLE MCU/LIN 54-SOIC
06FMN-BMTTR-A-TB CONN FMN HSNG 6POS STAG REV SMD
046232104103800+ CONN FFC/FPC 4POS 1MM R/A SMD
046232106103800 CONN FFC/FPC 6POS 1MM R/A SMD
046232106103800+ CONN FFC/FPC 6POS 1MM R/A SMD
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