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| 型号： | MPC5200VR466BR2 |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 466 MHz, MICROPROCESSOR, PBGA272 |
| 封装： | 27 X 27 MM, 1.27 MM PITCH, ROHS COMPLIANT, PLASTIC, BGA-272 |
| 文件页数： | 3/80页 |
| 文件大小： | 788K |
| 代理商： | MPC5200VR466BR2 |
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Electrical and Thermal Characteristics
MPC5200B Data Sheet, Rev. 0.6
Freescale Semiconductor
11
3.1.6
Thermal Characteristics
3.1.6.1
Heat Dissipation
An estimation of the chip-junction temperature, TJ, can be obtained from the following equation:
TJ =TA+(RθJA × PD)
Eqn. 3
where:
TA = ambient temperature for the package (C)
RθJA = junction to ambient thermal resistance (C/W)
PD = power dissipation in package (W)
The junction to ambient thermal resistance is an industry standard value, which provides a quick and easy
estimation of thermal performance. Unfortunately, there are two values in common usage: the value
determined on a single layer board, and the value obtained on a board with two planes. For packages such
as the PBGA, these values can be different by a factor of two. Which value is correct depends on the power
dissipated by other components on the board. The value obtained on a single layer board is appropriate for
the tightly packed printed circuit board. The value obtained on the board with the internal planes is usually
appropriate if the board has low power dissipation and the components are well separated.
Table 7. Thermal Resistance Data
Rating
Board Layers
Sym
Value
Unit
Notes
SpecID
Junction to Ambient
Natural Convection
Single layer board
(1s)
RθJA
30
°C/W
(1),(2)
NOTES:
1
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting
site (board) temperature, ambient temperature, air flow, power dissipation of other components on the board, and
board thermal resistance.
2
Per SEMI G38-87 and JEDEC JESD51-2 with the single layer board horizontal.
D6.1
Junction to Ambient
Natural Convection
Four layer board (2s2p)
RθJMA
22
°C/W
(1),(3)
3
Per JEDEC JESD51-6 with the board horizontal.
D6.2
Junction to Ambient (@200
ft/min)
Single layer board
(1s)
RθJMA
24
°C/W
D6.3
Junction to Ambient (@200
ft/min)
Four layer board
(2s2p)
RθJMA
19
°C/W
D6.4
Junction to Board
RθJB
14
°C/W
(4)
4
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
D6.5
Junction to Case
RθJC
8°C/W
(5)
5
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1).
D6.6
Junction to Package Top
Natural Convection
Ψ
JT
2°C/W
(6)
6
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter
is written as Psi-JT.
D6.7
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