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参数资料
| 型号： | MPC603ERX200LX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 27/36页 |
| 文件大小： | 451K |
| 代理商： | MPC603ERX200LX |
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PID7t-603e Hardware Specifications
33
Ordering Information
design and its operating conditions. In addition to the component's power consumption, a number of factors
affect the nal operating die-junction temperatureairow, board population (local heat ux of adjacent
components), heat sink efciency, heat sink attach, heat sink placement, next-level interconnect technology,
system air temperature rise, altitude, etc.
Due to the complexity and the many variations of system-level boundary conditions for today's
microelectronic equipment, the combined effects of the heat transfer mechanisms (radiation, convection and
conduction) may vary widely. For these reasons, we recommend using conjugate heat transfer models for
the board, as well as, system-level designs. To expedite system-level thermal analysis, several compact
thermal-package models are available within FLOTHERM¨. These are available upon request.
1.9 Ordering Information
Figure 19 provides the part numbering nomenclature for the PID7t-603e. Note that the individual part
numbers correspond to a maximum processor core frequency. For available frequencies, contact your local
Motorola sales ofce.
In addition to the processor frequency, the part numbering scheme also consists of a part modier and
application modier. The part modier indicates any enhancement(s) in the part from the original design.
The application modier may specify special bus frequencies or application conditions. Each part number
also contains a revision code. This refers to the die mask revision number and is specied in the part
numbering scheme for identication purposes only.
Figure 19. Part Number Key
MPC 603 R RX XXX X X
Product Code
Part Identifier
Part Modifier
Application Modifier
(R = Remapped, Enhanced, Low-Voltage)
(L = Any Valid PLL Configuration)
Package
Processor Frequency
(Contact Motorola Sales Office)
Revision Level
(RX = CBGA without Lid)
(T = Extended Termperature Range)
(ZT = PBGA Package)
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相关代理商/技术参数 |
参数描述 |
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| MPC603RRX200LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX200TC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX266LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX266TC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX300LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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