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参数资料
| 型号： | MPC603ERX200LX |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| 封装： | 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件页数： | 35/36页 |
| 文件大小： | 451K |
| 代理商： | MPC603ERX200LX |
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8
PID7t-603e Hardware Specifications
Electrical and Thermal Characteristics
1.4.2.1 Clock AC Specications
Table 7 provides the clock AC timing specications as dened in Figure 1. After fabrication, parts are sorted
by maximum processor core frequency as shown in Section 1.4.2.1, Clock AC Specications, and tested
for conformance to the AC specications for that frequency. Parts are sold by maximum processor core
frequency; see Section 1.9, Ordering Information.
Table 7. Clock AC Timing Specifications
Vdd = AVdd = 2.5 ± 5% V dc, OVdd = 3.3 ± 5% V dc, GND = 0 V dc, 0
Tj 105 °C
Num
Characteristic
200 MHz
PBGA
200 MHz
CBGA
266 MHz
CBGA
300 MHz
CBGA
Unit
Notes
Min
Max
Min
Max
Min
Max
Min
Max
Processor
frequency
100
200
80
200
150
266
180
300
MHz
1,6
VCO
frequency
300
400
300
400
300
532
360
600
MHz
1
SYSCLK
frequency
25
66.67
25
66.67
25
75
33.3
75
MHz
1
SYSCLK
cycle time
13.3
40
13.3
40
13.3
40
13.3
30
ns
2,3
SYSCLK rise
and fall time
—
2.0
—
2.0
—
2.0
—
2.0
ns
2
4
SYSCLK duty
cycle measured at
1.4 V
40.0
60.0
40.0
60.0
40.0
60.0
40.0
60.0
%
3
SYSCLK jitter
—
±150
—
±150
—
±150
—
±150
ps
4
PID7t internal
PLL-relock time
—
100
—
100
—
100
—
100
ms
3,5
Notes:
1. Caution: The SYSCLK frequency and PLL_CFG[0–3] settings must be chosen such that the resulting
SYSCLK (bus) frequency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their
respective maximum or minimum operating frequencies. Refer to the PLL_CFG[0–3] signal description
in Section 1.8, “System Design Information,” for valid PLL_CFG[0–3] settings.
2. Rise and fall times for the SYSCLK input are measured from 0.4 V to 2.4 V.
3. Timing is guaranteed by design and characterization, and is not tested.
4. Cycle-to-cycle jitter, and is guaranteed by design. The total input jitter (short term and long term
combined) must be under ±150 ps to guarantee the input/output timing of Section 1.4.2.2, “Input AC
5. Relock timing is guaranteed by design and characterization, and is not tested. PLL-relock time is the
maximum time required for PLL lock after a stable Vdd, OVdd, AVdd, and SYSCLK are reached during
the power-on reset sequence. This specication also applies when the PLL has been disabled and
subsequently re-enabled during sleep mode. Also note that HRESET must be held asserted for a
minimum of 255 bus clocks after the PLL-relock time (100
ms) during the power-on reset sequence.
6. Operation below 150 MHz is supported only by PLL_CFG[0–3] = 0b0101. Refer to Section 1.8.1, “PLL
Conguration” for additional information.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC603RRX200LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX200TC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX266LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX266TC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC603RRX300LC | 功能描述:微处理器 - MPU 603R REV2.1 HIP3.0 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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