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参数资料
| 型号： | MPC8241LZQ166X |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
| 文件页数： | 46/60页 |
| 文件大小： | 752K |
| 代理商： | MPC8241LZQ166X |
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50
MPC8241 Integrated Processor Hardware Specifications
MOTOROLA
System Design Information
1.7.8.1
Internal Package Conduction Resistance
For the PBGA, die-up, packaging technology, shown in Figure 29, the intrinsic conduction thermal
resistance paths are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 31 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 31. PBGA Package with Heat Sink Mounted to a Printed-Circuit Board
For this die-up, wire-bond PBGA package, heat generated on the active side of the chip is conducted mainly
through the mold cap, the heat sink attach material (or thermal interface material), and finally through the
heat sink where it is removed by forced-air convection.
1.7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended between the top of the mold cap and the bottom of the heat
sink to minimize the thermal contact resistance. For those applications where the heat sink is attached by
spring clip mechanism, Figure 32 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function of
contact pressure. As shown, the performance of these thermal interface materials improves with increasing
contact pressure. The use of thermal grease significantly reduces the interface thermal resistance. That is,
the bare joint results in a thermal resistance approximately seven times greater than the thermal grease joint.
Heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit board (see
Figure 29). Therefore, the synthetic grease offers the best thermal performance, considering the low
interface pressure. Of course, the selection of any thermal interface material depends on many factors:
thermal performance requirements, manufacturability, service temperature, dielectric properties, cost, etc.
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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相关代理商/技术参数 |
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| MPC8241LZQ200D | 功能描述:微处理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241LZQ200D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357 |
| MPC8241LZQ266D | 功能描述:微处理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241TVR166D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241TVR200D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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