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参数资料
| 型号： | MPC8241LZQ166X |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 166 MHz, RISC PROCESSOR, PBGA357 |
| 封装： | 25 X 25 MM, 1.27 MM PITCH, PLASTIC, BGA-357 |
| 文件页数： | 5/60页 |
| 文件大小： | 752K |
| 代理商： | MPC8241LZQ166X |
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MOTOROLA
MPC8241 Integrated Processor Hardware Specifications
13
Electrical and Thermal Characteristics
1.4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8241. For further information, see
1.4.3
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8241. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
frequency. See Section 1.9, “Ordering Information.”
Table 7 provides the operating frequency information for the MPC8241 at recommended operating
Table 6. Thermal Characterization Data
Rating
Board Description
Symbol
Value 7
(166- and
200-MHz
Parts)
Value 7
(266-MHz
Part)
Unit
Notes
Junction-to-ambient
natural convection
Single-layer board (1s)
RθJA
38
28
°C/W
1, 2
Junction-to-ambient
natural convection
Four-layer board (2s2p)
RθJMA
25
20
°C/W
1, 3
Junction-to-ambient
(@200 ft/min)
Single-layer board (1s)
RθJMA
31
22
°C/W
1, 3
Junction-to-ambient
(@200 ft/min)
Four-layer board (2s2p)
RθJMA
22
17
°C/W
1, 3
Junction-to-board
(bottom)
Four-layer board (2s2p)
RθJB
17
11
°C/W
4
Junction-to-case (top)
Single-layer board (1s)
RθJC
8
7
°C/W
5
Junction-to-package top
Natural convection
Ψ
JT
2
°C/W
6
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate
method (MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
6. Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per EIA/JESD51-2.
7. Note that the 166- and 200-MHz parts are in a two-layer package and the 266-MHz part is in a four-layer package.
This results in different thermal characterization data for the two package types.
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| MPC8241LZQ200D | 功能描述:微处理器 - MPU 200MHz 380MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241LZQ200D | 制造商:Freescale Semiconductor 功能描述:IC 32BIT MPU 200MHZ BGA-357 |
| MPC8241LZQ266D | 功能描述:微处理器 - MPU 266MHz 266MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241TVR166D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8241TVR200D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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