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参数资料
| 型号： | MPC8245LZU266D |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352 |
| 封装： | 35 X 35 MM, 1.27 MM PITCH, TBGA-352 |
| 文件页数： | 48/64页 |
| 文件大小： | 893K |
| 代理商： | MPC8245LZU266D |
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MPC8245 Integrated Processor Hardware Specifications
MOTOROLA
System Design Information
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal
performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. Other
heat sinks offered by Aavid Thermalloy, Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering
offer different heat sink-to-ambient thermal resistances and may or may not need airflow.
1.7.8.1
Internal Package Conduction Resistance
The intrinsic conduction thermal resistance paths for the TBGA cavity-down packaging technology shown
in Figure 31 are as follows:
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 31 depicts the primary heat transfer path for a package with an attached heat sink mounted on a
printed-circuit board.
Figure 31. TBGA Package with Heat Sink Mounted to a Printed-Circuit Board
In a TBGA package the active side of the die faces the printed-circuit board. Most of the heat travels through
the die, across the die attach layer, and into the copper spreader. Some of the heat is removed from the top
surface of the spreader through convection and radiation. Another portion of the heat enters the
printed-circuit board through the solder balls. The heat is then removed off the exposed surfaces of the board
through convection and radiation. If a heat sink is used, a larger percentage of heat leaves through the top
side of the spreader.
1.7.8.2
Adhesives and Thermal Interface Materials
A thermal interface material is recommended between the top of the package and the bottom of the heat sink
to minimize thermal contact resistance. For those applications where the heat sink is attached by a spring
clip mechanism, Figure 32 shows the thermal performance of three thin-sheet thermal-interface materials
External Resistance
Internal Resistance
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
(Note the internal versus external package resistance)
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| MPC8245LZU333D | 功能描述:微处理器 - MPU 333MHz 632.7MIPS RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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| MPC8245RZU400D | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:Part Number Specification for the MPC8245ARZUnnnX Series |
| MPC8245TVV266D | 功能描述:微处理器 - MPU INTEGRATED HOST PROC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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