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参数资料
| 型号： | MPC8245LZU266D |
| 厂商： | MOTOROLA INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352 |
| 封装： | 35 X 35 MM, 1.27 MM PITCH, TBGA-352 |
| 文件页数： | 5/64页 |
| 文件大小： | 893K |
| 代理商： | MPC8245LZU266D |
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MOTOROLA
MPC8245 Integrated Processor Hardware Specifications
13
Electrical and Thermal Characteristics
1.4.2
Thermal Characteristics
Table 6 provides the package thermal characteristics for the MPC8245. For further information, see
1.4.3
AC Electrical Characteristics
This section provides the AC electrical characteristics for the MPC8245. After fabrication, functional parts
are sorted by maximum processor core frequency as shown in Table 7 and tested for conformance to the AC
specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN)
clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core
frequency. See Section 1.9, “Ordering Information,” for more details on ordering parts.
Table 6. Thermal Characteristics
Characteristic
Symbol
Value
Unit
Notes
Junction-to-ambient natural convection
(Single-layer board—1s)
RθJA
16.1
°C/W
1, 2
Junction-to-ambient natural convection
(Four-layer board—2s2p)
RθJMA
12.0
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Single-layer board—1s)
RθJMA
11.6
°C/W
1, 3
Junction-to-ambient (@200 ft/min)
(Four layer board—2s2p)
RθJMA
9.0
°C/W
1, 3
Junction-to-board
RθJB
4.8
°C/W
4
Junction-to-case
RθJC
1.8
°C/W
5
Junction-to-package top (natural convection)
ΨJT
1.0
°C/W
6
Notes:
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site
(board) temperature, ambient temperature, airflow, power dissipation of other components on the board, and board
thermal resistance.
2. Per SEMI G38-87 and JEDEC JESD51-2 with the single-layer board horizontal.
3. Per JEDEC JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
5. Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL
SPEC-883 Method 1012.1) with the cold plate used for case temperature.
6. Thermal characterization parameter indicating the temperature difference between the package top and the
junction temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization
parameter is written as Psi-JT.
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