参数资料
型号: MPC8245LZU266D
厂商: MOTOROLA INC
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 266 MHz, RISC PROCESSOR, PBGA352
封装: 35 X 35 MM, 1.27 MM PITCH, TBGA-352
文件页数: 6/64页
文件大小: 893K
代理商: MPC8245LZU266D
14
MPC8245 Integrated Processor Hardware Specifications
MOTOROLA
Electrical and Thermal Characteristics
Table 7 provides the operating frequency information for the MPC8245 at recommended operating
conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V.
1.4.3.1
Clock AC Specifications
Table 8 provides the clock AC timing specifications at recommended operating conditions, as defined in
Section 1.4.3.2, “Input AC Timing Specifications.” These specifications are for the default driver strengths
indicated in Table 4.
Table 7. Operating Frequency 1
Characteristic 2, 3
266 MHz
300 MHz
333 MHz
350 MHz
Unit
VDD/AVDD/AVDD2 = 1.8/2.0 ± 100 mV
VDD/AVDD/AVDD2 = 2.0 ± 100 mV
Processor frequency
(CPU)
100–266
100–300
100–333
100–350
MHz
Memory bus frequency
50–133
50–100 4
50–133
50–100 4
MHz
PCI input frequency
25–66
MHz
Notes:
1. See part number specification document MPC8245RZUPNS for additional part offering information.
2. Caution: The PCI_SYNC_IN frequency and PLL_CFG[0:4] settings must be chosen such that the resulting
peripheral logic/memory bus frequency and CPU (core) frequencies do not exceed their respective maximum or
minimum operating frequencies. Refer to the PLL_CFG[0:4] signal description in Section 1.6, “PLL Configurations,
for valid PLL_CFG[0:4] settings and PCI_SYNC_IN frequencies.
3. See Table 18 and Table 19 for more details on VCO limitations for memory and CPU VCO frequencies of various
PLL configurations.
4. There are no available PLL_CFG[0:4] settings that support 133-MHz memory interface operation at 300-MHz and
350-MHz CPU operation, since the multipliers do not allow a 300:133 and 350:133 ratio relation. However, running
these parts at slower processor speeds may produce ratios that will run above 100 MHz. See Table 18 for the PLL
settings.
Table 8. Clock AC Timing Specifications
At recommended operating conditions (see Table 2) with LVDD = 3.3 V ± 0.3 V
Num
Characteristics and Conditions
Min
Max
Unit
Notes
1a
Frequency of operation (PCI_SYNC_IN)
25
66
MHz
2, 3
PCI_SYNC_IN rise and fall times
2.0
ns
1
4
PCI_SYNC_IN duty cycle measured at 1.4 V
40
60
%
5a
PCI_SYNC_IN pulse width high measured at 1.4 V
6
9
ns
2
5b
PCI_SYNC_IN pulse width low measured at 1.4 V
6
9
ns
2
7
PCI_SYNC_IN jitter
200
ps
8a
PCI_CLK[0:4] skew (pin-to-pin)
250
ps
8b
SDRAM_CLK[0:3] skew (pin-to-pin)
190
ps
3
10
Internal PLL relock time
100
s
2, 4, 5
15
DLL lock range with DLL_EXTEND = 0 disabled
(default)
(N
× Tclk – Tdp(max)) ≤ Tloop
≤ (N × Tclk – Tdp(min))
ns
6
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