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| 型号： | MPC8306CVMADDCA |
| 厂商： | FREESCALE SEMICONDUCTOR INC |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 266 MHz, RISC PROCESSOR, PBGA369 |
| 封装： | 19 X 19 MM, 1.61 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MAPBGA-369 |
| 文件页数： | 65/76页 |
| 文件大小： | 474K |
| 代理商： | MPC8306CVMADDCA |
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MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 0
68
Freescale Semiconductor
Thermal
TA = ambient temperature for the package (C)
RJA = junction-to-ambient thermal resistance (C/W)
PD = power dissipation in the package (W)
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy
estimation of thermal performance. As a general statement, the value obtained on a single layer board is
appropriate for a tightly packed printed-circuit board. The value obtained on the board with the internal
planes is usually appropriate if the board has low power dissipation and the components are well separated.
Test cases have demonstrated that errors of a factor of two (in the quantity TJ – TA) are possible.
23.1.3
Estimation of Junction Temperature with Junction-to-Board
Thermal Resistance
The thermal performance of a device cannot be adequately predicted from the junction-to-ambient thermal
resistance. The thermal performance of any component is strongly dependent on the power dissipation of
surrounding components. In addition, the ambient temperature varies widely within the application. For
many natural convection and especially closed box applications, the board temperature at the perimeter
(edge) of the package is approximately the same as the local air temperature near the device. Specifying
the local ambient conditions explicitly as the board temperature provides a more precise description of the
local ambient conditions that determine the temperature of the device.
At a known board temperature, the junction temperature is estimated using the following equation:
TJ =TB +(R
JB PD)
Eqn. 2
where:
TJ = junction temperature (C)
TB = board temperature at the package perimeter (C)
RJB = junction-to-board thermal resistance (C/W) per JESD51-8
PD = power dissipation in package (W)
When the heat loss from the package case to the air can be ignored, acceptable predictions of junction
temperature can be made. The application board should be similar to the thermal test condition: the
component is soldered to a board with internal planes.
23.1.4
Experimental Determination of Junction Temperature
To determine the junction temperature of the device in the application after prototypes are available, the
thermal characterization parameter (
JT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ =TT +(JT PD)
Eqn. 3
where:
TJ = junction temperature (C)
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| MPC8306CVMAFDCA | 功能描述:微处理器 - MPU E300 MP ext tmp 333 RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8306EC | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications |
| MPC8306-KIT | 功能描述:开发板和工具包 - 其他处理器 For MPC8306 Ethernet USB I2C SPI RoHS:否 制造商:Freescale Semiconductor 产品:Development Systems 工具用于评估:P3041 核心:e500mc 接口类型:I2C, SPI, USB 工作电源电压: |
| MPC8306-KIT | 制造商:Freescale Semiconductor 功能描述:MPC830x Processor Evaluation Kit |
| MPC8306S | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC II Pro Processors |
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