参数资料
型号: MPC8323E-RDB
厂商: Freescale Semiconductor
文件页数: 14/82页
文件大小: 0K
描述: BOARD REFERENCE DESIGN
产品培训模块: MPC8323E PowerQUICC II Pro Processor
标准包装: 1
系列: PowerQUICC II™ PRO
类型: MCU
适用于相关产品: MPC8323E
所含物品: 参考设计板、软件和说明文档
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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
21
Ethernet and MII Management
Figure 7 shows the MII transmit AC timing diagram.
Figure 7. MII Transmit AC Timing Diagram
8.2.1.2
MII Receive AC Timing Specifications
Table 24 provides the MII receive AC timing specifications.
TX_CLK data clock fall time
tMTXF
1.0
4.0
ns
Note:
1. The symbols used for timing specifications follow the pattern of t(first two letters of functional block)(signal)(state)(reference)(state) for
inputs and t(first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example, tMTKHDX symbolizes MII transmit
timing (MT) for the time tMTX clock reference (K) going high (H) until data outputs (D) are invalid (X). Note that, in general,
the clock reference symbol representation is based on two to three letters representing the clock of a particular functional.
For example, the subscript of tMTX represents the MII(M) transmit (TX) clock. For rise and fall times, the latter convention is
used with the appropriate letter: R (rise) or F (fall).
Table 24. MII Receive AC Timing Specifications
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typical
Max
Unit
RX_CLK clock period 10 Mbps
tMRX
—400
ns
RX_CLK clock period 100 Mbps
tMRX
—40
ns
RX_CLK duty cycle
tMRXH/tMRX
35
65
%
RXD[3:0], RX_DV, RX_ER setup time to RX_CLK
tMRDVKH
10.0
ns
RXD[3:0], RX_DV, RX_ER hold time to RX_CLK
tMRDXKH
10.0
ns
RX_CLK clock rise time
tMRXR
1.0
4.0
ns
Table 23. MII Transmit AC Timing Specifications (continued)
At recommended operating conditions with OVDD of 3.3 V ± 10%.
Parameter/Condition
Symbol1
Min
Typical
Max
Unit
TX_CLK
TXD[3:0]
tMTKHDX
tMTX
tMTXH
tMTXR
tMTXF
TX_EN
TX_ER
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