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| 型号： | MPC8323E-RDB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 73/82页 |
| 文件大小： | 0K |
| 描述： | BOARD REFERENCE DESIGN |
| 产品培训模块： | MPC8323E PowerQUICC II Pro Processor |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MCU |
| 适用于相关产品： | MPC8323E |
| 所含物品： | 参考设计板、软件和说明文档 |
| 相关产品： | MPC8323CVRADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323CVRAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323CZQADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323CZQAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ECVRAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ECVRADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ZQAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ZQADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323VRADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323EZQAFDC-ND - IC MPU POWERQUICC II 516-PBGA 更多... |
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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
Freescale Semiconductor
75
Thermal
Wakefield Engineering
603-635-5102
33 Bridge St.
Pelham, NH 03076
Internet: www.wakefield.com
Interface material vendors include the following:
Chomerics, Inc.
781-935-4850
77 Dragon Ct.
Woburn, MA 01801
Internet: www.chomerics.com
Dow-Corning Corporation
800-248-2481
Dow-Corning Electronic Materials
P.O. Box 994
Midland, MI 48686-0997
Internet: www.dowcorning.com
Shin-Etsu MicroSi, Inc.
888-642-7674
10028 S. 51st St.
Phoenix, AZ 85044
Internet: www.microsi.com
The Bergquist Company
800-347-4572
18930 West 78th St.
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
23.3
Heat Sink Attachment
When attaching heat sinks to these devices, an interface material is required. The best method is to use
thermal grease and a spring clip. The spring clip should connect to the printed-circuit board, either to the
board itself, to hooks soldered to the board, or to a plastic stiffener. Avoid attachment forces which would
lift the edge of the package or peel the package from the board. Such peeling forces reduce the solder joint
lifetime of the package. Recommended maximum force on the top of the package is 10 lb (4.5 kg) force.
If an adhesive attachment is planned, the adhesive should be intended for attachment to painted or plastic
surfaces and its performance verified under the application requirements.
23.3.1
Experimental Determination of the Junction Temperature with a
Heat Sink
When heat sink is used, the junction temperature is determined from a thermocouple inserted at the
interface between the case of the package and the interface material. A clearance slot or hole is normally
required in the heat sink. Minimizing the size of the clearance is important to minimize the change in
thermal performance caused by removing part of the thermal interface to the heat sink. Because of the
experimental difficulties with this technique, many engineers measure the heat sink temperature and then
back calculate the case temperature using a separate measurement of the thermal resistance of the
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8323E-RDB | 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway |
| MPC8323EVRADDC | 功能描述:微处理器 - MPU 8323 NOPB PBGA W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8323EVRADDCA | 制造商:Freescale Semiconductor 功能描述:POWERQUICC, 32 BIT POWER ARCHITECTURE SOC, 266MHZ E300, QE, - Trays 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 266MHZ 516BGA |
| MPC8323EVRAFDC | 功能描述:微处理器 - MPU 8323 NOPB PBGA W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8323EVRAFDCA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
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