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| 型号： | MPC8323E-RDB |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 72/82页 |
| 文件大小： | 0K |
| 描述： | BOARD REFERENCE DESIGN |
| 产品培训模块： | MPC8323E PowerQUICC II Pro Processor |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MCU |
| 适用于相关产品： | MPC8323E |
| 所含物品： | 参考设计板、软件和说明文档 |
| 相关产品： | MPC8323CVRADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323CVRAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323CZQADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323CZQAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ECVRAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ECVRADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ZQAFDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323ZQADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323VRADDC-ND - IC MPU PWRQUICC II 516-PBGA MPC8323EZQAFDC-ND - IC MPU POWERQUICC II 516-PBGA 更多... |
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MPC8323E PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 4
74
Freescale Semiconductor
Thermal
where:
RθJA = junction-to-ambient thermal resistance (°C/W)
RθJC = junction-to-case thermal resistance (°C/W)
RθCA = case-to-ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case-to-ambient thermal resistance, RθCA. For instance, the user can change the size of the heat
sink, the air flow around the device, the interface material, the mounting arrangement on printed-circuit
board, or change the thermal dissipation on the printed-circuit board surrounding the device.
To illustrate the thermal performance of the devices with heat sinks, the thermal performance has been
simulated with a few commercially available heat sinks. The heat sink choice is determined by the
application environment (temperature, air flow, adjacent component power dissipation) and the physical
space available. Because there is not a standard application environment, a standard heat sink is not
required.
Accurate thermal design requires thermal modeling of the application environment using computational
fluid dynamics software which can model both the conduction cooling and the convection cooling of the
air moving through the application. Simplified thermal models of the packages can be assembled using the
junction-to-case and junction-to-board thermal resistances listed in the thermal resistance table. More
detailed thermal models can be made available on request.
Heat sink vendors include the following list:
Aavid Thermalloy
603-224-9988
80 Commercial St.
Concord, NH 03301
Internet: www.aavidthermalloy.com
Alpha Novatech
408-567-8082
473 Sapena Ct. #12
Santa Clara, CA 95054
Internet: www.alphanovatech.com
International Electronic Research Corporation (IERC) 818-842-7277
413 North Moss St.
Burbank, CA 91502
Internet: www.ctscorp.com
Millennium Electronics (MEI)
408-436-8770
Loroco Sites
671 East Brokaw Road
San Jose, CA 95112
Internet: www.mei-thermal.com
Tyco Electronics
800-522-2800
Chip Coolers
P.O. Box 3668
Harrisburg, PA 17105-3668
Internet: www.chipcoolers.com
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8323E-RDB | 制造商:Freescale Semiconductor 功能描述:MPC8323E Integrated Multiservice Gateway |
| MPC8323EVRADDC | 功能描述:微处理器 - MPU 8323 NOPB PBGA W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8323EVRADDCA | 制造商:Freescale Semiconductor 功能描述:POWERQUICC, 32 BIT POWER ARCHITECTURE SOC, 266MHZ E300, QE, - Trays 制造商:Freescale Semiconductor 功能描述:IC MPU PWRQUICC 266MHZ 516BGA |
| MPC8323EVRAFDC | 功能描述:微处理器 - MPU 8323 NOPB PBGA W/ENC RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
| MPC8323EVRAFDCA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Integrated Communications Processor Family Hardware Specifications |
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