参数资料
型号: MPC8377E-RDBA
厂商: Freescale Semiconductor
文件页数: 115/127页
文件大小: 0K
描述: BOARD REF DES MPC8377 REV 2.1
设计资源: MPC8379E-RDB Ref Design Guide
标准包装: 1
系列: PowerQUICC II™ PRO
类型: MPU
适用于相关产品: MPC8377E
所含物品: 板,CD
相关产品: MPC8378EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA
MPC8378EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA
MPC8378EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA
MPC8378EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA
MPC8379EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA
MPC8379EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA
MPC8379EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA
MPC8379EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA
MPC8377EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA
MPC8377EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA
更多...
MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
88
Freescale Semiconductor
21.3
SerDes Transmitter and Receiver Reference Circuits
This figure shows the reference circuits for SerDes data lane’s transmitter and receiver.
Figure 62. SerDes Transmitter and Receiver Reference Circuits
The DC and AC specification of SerDes data lanes are defined in each interface protocol section below in
this document based on the application usage:
Note that an external AC coupling capacitor is required for the above three serial transmission protocols
with the capacitor value defined in specification of each protocol section.
22 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions.
22.1
Package Parameters for the MPC8377E TePBGA II
The package parameters are provided in the following list. The package type is 31 mm
× 31 mm,
689 plastic ball grid array (TePBGA II).
Package outline
31 mm
× 31 mm
Interconnects
689
Pitch
1.00 mm
Module height (typical)
2.0 mm to 2.46 mm (maximum)
Solder Balls
3.5% Ag, 96.5% Sn
Ball diameter (typical)
0.60 mm
50
Ω
50
Ω
Receiver
Transmitter
SD1_TX
n or
SD2_TX
n
SD1_TX
n or
SD2_TX
n
SD1_RX
n or
SD2_RX
n
SD1_RX
n or
SD2_RX
n
50
Ω
50
Ω
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