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| 型号： | MPC8377E-RDBA |
| 厂商： | Freescale Semiconductor |
| 文件页数： | 26/127页 |
| 文件大小： | 0K |
| 描述： | BOARD REF DES MPC8377 REV 2.1 |
| 设计资源： | MPC8379E-RDB Ref Design Guide |
| 标准包装： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 类型： | MPU |
| 适用于相关产品： | MPC8377E |
| 所含物品： | 板，CD |
| 相关产品： | MPC8378EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA MPC8378EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8378EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA MPC8378EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA MPC8379EVRANG-ND - MPU PWRQUICC II 800MHZ 689TEPBGA MPC8379EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8379EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA MPC8379EVRAGD-ND - MPU PWRQUICC II 400MHZ 689TEPBGA MPC8377EVRALG-ND - MPU PWRQUICC II 667MHZ 689TEPBGA MPC8377EVRAJF-ND - MPU PWRQUICC II 533MHZ 689TEPBGA 更多... |
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MPC8377E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
121
These capacitors should have a value of 0.01 or 0.1 F. Only ceramic SMT (surface mount technology)
capacitors should be used to minimize lead inductance, preferably 0402 or 0603 sizes.
In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB,
feeding the VDD, OVDD, GVDD, and LVDD planes, to enable quick recharging of the smaller chip
capacitors. These bulk capacitors should have a low ESR (equivalent series resistance) rating to ensure the
quick response time necessary. They should also be connected to the power and ground planes through two
vias to minimize inductance. Suggested bulk capacitors—100–330 F (AVX TPS tantalum or Sanyo
OSCON).
25.3
Connection Recommendations
To ensure reliable operation, it is highly recommended that unused inputs be connected to an appropriate
signal level. Unused active low inputs should be tied to OVDD, GVDD, or LVDD as required. Unused
active high inputs should be connected to GND. All NC (no-connect) signals must remain unconnected.
Power and ground connections must be made to all external VDD, GVDD, LVDD, OVDD, and GND pins
of the device.
25.4
Output Buffer DC Impedance
The device drivers are characterized over process, voltage, and temperature. For all buses, the driver is a
push-pull single-ended driver type (open drain for I2C).
To measure Z0 for the single-ended drivers, an external resistor is connected from the chip pad to OVDD
or GND. Then, the value of each resistor is varied until the pad voltage is OVDD/2 (see Figure 66). The
output impedance is the average of two components, the resistances of the pull-up and pull-down devices.
When data is held high, SW1 is closed (SW2 is open) and RP is trimmed until the voltage at the pad equals
OVDD/2. RP then becomes the resistance of the pull-up devices. RP and RN are designed to be close to each
other in value. Then, Z0 = (RP + RN)/2.
Figure 66. Driver Impedance Measurement
OVDD
OGND
RP
RN
Pad
Data
SW1
SW2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| MPC8377E-RDBA | 制造商:Freescale Semiconductor 功能描述:MPC837x Family Reference Desig |
| MPC8377EVRAFDA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAFFA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAFGA | 制造商:FREESCALE 制造商全称:Freescale Semiconductor, Inc 功能描述:PowerQUICC? II Pro Processor Hardware Specifications |
| MPC8377EVRAGD | 功能描述:微处理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 处理器系列:SAMA5D31 核心:ARM Cortex A5 数据总线宽度:32 bit 最大时钟频率:536 MHz 程序存储器大小:32 KB 数据 RAM 大小:128 KB 接口类型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作电源电压:1.8 V to 3.3 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:FBGA-324 |
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